ATS-16D-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16D-10-C1-R0-ND

Manufacturer Part#:

ATS-16D-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16D-10-C1-R0 datasheetATS-16D-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management technology has become more important in the modern computing era. Heat sinks help to dissipate heat away from the source and maintain optimal operating temperatures inside electronic systems. The ATS-16D-10-C1-R0 is a device designed to regulate the flow of heat in electronic circuits. It is designed to be used in a wide range of applications and is often used in the industrial, medical, and military sectors.

The ATS-16D-10-C1-R0 is a thermal heat sink device designed for maximum efficiency, reliability and affordability. It can be used for high-power applications such as power supplies and advanced communication systems. The compact design of the ATS-16D-10-C1-R0 makes it suitable for applications in confined spaces. It is used to reduce heat buildup and minimize thermal resistance.

The ATS-16D-10-C1-R0 utilises a vertical fin construction which helps to increase the overall heat dissipation surface area. The device also has a large base area with a number of channels in which hot air can pass through. This helps to rapidly disperse heat across the unit. The thermal performance of the ATS-16D-10-C1-R0 is further improved by the addition of a large number of aero-fins. These fins increase the surface area of the device, allowing it to effectively dissipate more heat.

The working principle of the ATS-16D-10-C1-R0 is simple and effective. The impressive combination of fin construction and efficient finning ensures that heat is dissipated quickly and evenly. The fins also help increase the overall heat dissipation surface area by up to 20%. This helps to ensure that the device maintains optimal operating temperatures.

The ATS-16D-10-C1-R0 is an effective and reliable thermal heat sink device. It has a wide range of versatile applications and can be used in power supplies, advanced communication systems and electronics. The device utilises a vertical fin construction which increases the overall heat dissipation surface area. The efficient finning and aero-fins also help increase the heat dissipation surface area by up to 20%. This ensures that the device maintains optimal operating temperatures.

The specific data is subject to PDF, and the above content is for reference

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