| Allicdata Part #: | ATS-16D-120-C1-R0-ND |
| Manufacturer Part#: |
ATS-16D-120-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-120-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.06684 |
| 30 +: | $ 2.98431 |
| 50 +: | $ 2.81849 |
| 100 +: | $ 2.65268 |
| 250 +: | $ 2.48686 |
| 500 +: | $ 2.40397 |
| 1000 +: | $ 2.15528 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-16D-120-C1-R0is a thermal component designed to effectively dissipate heat away from other electronic components. It is a type of heat sink, which is an essential component of any electronics package that contains heat-generating active components such as transistors, integrated circuits, and other power devices. The ATS-16D-120-C1-R0 is a finned heat sink that is designed to maximally dissipate heat from the surrounding components, thereby reducing the risk of damage due to excessive temperatures.
The ATS-16D-120-C1-R0 is designed for efficient cooling of a wide variety of electronic components. The heat sink is constructed of aluminum alloy, which has a high thermal conductivity, making it the perfect material for dissipating large amounts of heat efficiently. The heat sink also features a series of fins on the outer surface of the device, which help to increase the total surface area that is exposed to the ambient environment. This increase in surface area allows the heat sink to dissipate the generated heat more quickly, and thus more effectively cool the device in question.
The ATS-16D-120-C1-R0 is designed to be used in conjunction with other cooling components, such as fans and heat spreaders, in order to maximize the cooling effect. The heat sink features an integral mounting mechanism, which allows it to be securely mounted to the surface of other components in order to ensure maximum contact between the heat sink and the device that it is cooling. The heat sink also has an integrated clip to facilitate installation.
The ATS-16D-120-C1-R0 offers excellent thermal performance in a variety of electronic applications. The heat sink can be used in both active and passive cooling systems, dependent on the specific cooling requirements of the device. The heat sink is also designed to eliminate any interference that may be caused by other components. This prevents the performance of the device from being impacted by its proximity to other components, thus ensuring optimal operation.
In conclusion, the ATS-16D-120-C1-R0 is a thermal component designed to effectively dissipate heat away from other electronic components. The heat sink features an aluminum alloy construction, finned design, and integral mounting capabilities, all working together to ensure that temperatures remain safe and optimal performance is maintained. This makes the ATS-16D-120-C1-R0 the ideal choice for any application requiring effective thermal management.
The specific data is subject to PDF, and the above content is for reference