| Allicdata Part #: | ATS-16D-132-C3-R0-ND |
| Manufacturer Part#: |
ATS-16D-132-C3-R0 |
| Price: | $ 5.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-132-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.70799 |
| 30 +: | $ 4.44612 |
| 50 +: | $ 4.18459 |
| 100 +: | $ 3.92307 |
| 250 +: | $ 3.66153 |
| 500 +: | $ 3.40000 |
| 1000 +: | $ 3.33462 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to keep surfaces and components cool. Thermal management is crucial in ensuring optimal performance of these components for any application. Thermal – Heat Sinks are available in many shapes, sizes, and materials to meet the specific requirements of different applications. One such device available is the ATS-16D-132-C3-R0 Heat Sink.
The ATS-16D-132-C3-R0 is a high-performance heat sink that provides efficient heat dissipation. This device is made from aluminum alloy with a patented diamond cut surface, which provides high thermal conductivity and great resistance to corrosion and oxidation. The dimensions of the ATS-16D-132-C3-R0 are 4.8” x 4.2” x 1.2”. This compact size allows for easy integration into a variety of applications. The ATS-16D-132-C3-R0 includes two mounting screws and mounting holes for secure installation.
The ATS-16D-132-C3-R0 is designed for use in a range of electronic applications, including consumer electronics, telecommunications, automotive, industrial, medical, and more. Its versatility makes it suitable for many different types of applications. It can be used to dissipate heat from components such as LED, transistors, MOSFETs, laptop processors, and more. This heat sink is also compatible with many different types of power supplies and is certified with FCC, CE, and RoHS standards.
The ATS-16D-132-C3-R0 is designed with a high performance design for efficient heat dissipation. This device utilizes a bottom fin structure with vertical fins and a grooved surface, which allows for maximum heat conduction. The fins are connected to a base, which acts as a heatsink, providing efficient thermal conduction and dissipation. This design also prevents dust and debris from settling on the module, ensuring that it performs optimally and prevents overheating of components.
The ATS-16D-132-C3-R0 also includes an efficient air convection system. This system uses fans to circulate air through the module, helping to dissipate heat and keep components cool. This efficient air convection design allows the module to function optimally at higher thermal loads. Additionally, the fan is designed with low noise levels, allowing for quieter operation.
The ATS-16D-132-C3-R0 is an ideal choice for any application where efficient thermal management is needed. It is a high-performance heat sink that offers a compact size, high thermal conductivity, and efficient air convection design. This device is suitable for a range of applications including consumer electronics, telecommunications, automotive, industrial, medical and more. With its versatility and FCC, CE, and RoHS certification, the ATS-16D-132-C3-R0 is a great choice for any thermal management requirements.
The specific data is subject to PDF, and the above content is for reference