| Allicdata Part #: | ATS-16D-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-16D-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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。Thermal - Heat Sinks
The ATS-16D-139-C1-R0 is a type of heat sink, which is a device that is designed to absorb and disperse heat from other devices. Heat sinks can be as simple as an aluminum block or as complex as an intricate multi-fin aluminum or copper radiator. They provide a thermal barrier between a heat source and the surrounding environment so that heat energy can be dissipated more efficiently.
The ATS-16D-139-C1-R0 heat sink is a generic heat sink designed for the most common electronic applications. The device has a standard profile allowing it to fit into tight spaces. The sink is manufactured from 6061-T6 aluminum for light weight and resistance to corrosion. The fins are press-formed into an anodized surface, providing excellent thermal performance in an aesthetically pleasing design.
The ATS-16D-139-C1-R0 heat sink is designed to be used in a variety of applications, including desktop computers, servers, and other electronics that require efficient cooling. The device has a large surface area, allowing for efficient dissipation of heat energy. The sink is designed with an internal mounting system, making it easy to install in any application. It also has an optional fan mount, allowing for increased airflow and more effective cooling.
The ATS-16D-139-C1-R0 heat sink operates on a simple concept. Heat is generated by electronic components and dissipated by the heat sink. This heat is transferred either by radiation, convection, or conduction. As the heat energy moves, it is absorbed by the fins of the heat sink, which are designed to dissipate the heat energy into the surrounding atmosphere.
The ATS-16D-139-C1-R0 is an effective and efficient heat sink solution for a variety of applications. Its small profile and press-formed fins allow for more efficient cooling, while the internal mounting system makes installation easy. The optional fan mount increases airflow and cooling efficiency even further. The device is well-suited for applications where thermal management is critical, such as PCs, servers, and other electronics.
The specific data is subject to PDF, and the above content is for reference