| Allicdata Part #: | ATS-16D-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-16D-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-16D-14-C1-R0 is a thermal radiating component used for cooling electronic devices. It is typically used to dissipate heat through the process of conduction and convection, allowing the electronic devices to remain in optimal operating condition. Thermal radiating components such as ATS-16D-14-C1-R0 are necessary in managing the high temperatures generated from electronic circuits.
The thermal design of ATS-16D-14-C1-R0 consists of an aluminum base plate and a bonded copper frame. The aluminum base is largely responsible for dispersing the heat away from the surface of the device to be cooled, while the copper frame acts as a conduit for the transfer of heat to the surrounding air. The aluminum base is comprised of numerous layers, each with a specific purpose. The sandwich consists of an outer ribbed layer, a solid base layer, a cooling heat pipe, a small pipe and a spring. The copper frame is designed to act as a large heat spreader, removing heat from the backside of the device and transferring it to the aluminum base, where it can then be dissipated into the surrounding air.
The thermal design makes ATS-16D-14-C1-R0 an efficient heat sink for controlling and managing the heat of electronic components. The device works by transfering heat from the device to the aluminum base plate via the copper frame. Once the heat passes through the aluminum base, it is then dissipated through the natural cooling process of conduction and convection. By transfering the heat away from the device, the ATS-16D-14-C1-R0 allows the electronic components to maintain their optimal temperature, which increases their performance and longevity.
Though the ATS-16D-14-C1-R0 heat sink is designed for cooling electronics, it can also be used in numerous other applications. The device absorbs, dissipates and transfers heat in controlling the temperature of any item, making it a useful asset in many fields. Some of the most common applications for the ATS-16D-14-C1-R0 include automotive and aerospace electronics, heat exchangers, medical equipment, industrial power supplies and telecommunications.
Overall, ATS-16D-14-C1-R0 has proven to be an effective thermal radiating component that can be used in a variety of applications. By controlling the temperature of electronic components, it helps increase their performance and longevity. The device has also been found to be useful in a wide range of applications, including automotive and aerospace industries, heat exchangers, medical equipment, industrial power supplies and telecommunications.
The specific data is subject to PDF, and the above content is for reference