ATS-16D-155-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.47°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-16D-155-C3-R0: Thermal - Heat Sinks Application Field and Working Principle

Thermal - Heat Sinks are a type of heat-dissipating component commonly used in electronic devices and computing systems to regulate their temperature stability. The ATS-16D-155-C3-R0 is an example of this type of component, with a particular focus on its applications and working principles.In terms of usage, the ATS-16D-155-C3-R0 is designed to be employed in a variety of stationary and mobile applications. This type of thermal - heat sink is particularly useful in both the military and aerospace sectors, due to its ability to handle the extreme temperatures that can be reached in many of these applications. It is also highly suitable for use in medical instrumentation, industrial applications, automotive electronics and home appliances.The ATS-16D-155-C3-R0 is a thermally effective heat sink, thanks to its efficient thermal interface technology which utilizes a combination of high-quality aluminum fins and mixed graphite sheets that work together to deliver excellent heat dissipation. The aluminum fins are designed to maximize the surface area for air flow, allowing the air to flow more freely around the aluminum fins and reducing the chances of overheating. At the same time, the graphite sheets provide a thermal interface with the device it is connected to, increasing the rate of heat transfer. The ATS-16D-155-C3-R0 is designed to be easy to install in a range of different environments, thanks to its lightweight, modular design. This ensures that the device can be easily integrated into existing systems, and the modular design also allows for easy maintenance and upgrades.In terms of the working principle of the ATS-16D-155-C3-R0, the device works by dissipating the heat from the electronic device it is connected to. The heat is removed through the aluminum fins, which act as a heat sink, transferring the heat away from the device and into the surrounding environment. At the same time, the graphite sheet-based thermal interface increases the rate of heat transfer, ensuring that the device\'s temperature is kept stable.Overall, the ATS-16D-155-C3-R0 is a highly effective thermal - heat sink, designed to be used in a wide range of applications. Its efficient thermal interface technology allows it to dissipate heat in an effective manner, while its lightweight, modular design makes it easy to install in many different environments. Finally, its working principle of dissipating the heat away from the device while maintaining the temperature ensures its ability to provide reliable performance in even the most extreme conditions.

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