
Allicdata Part #: | ATS-16D-167-C1-R0-ND |
Manufacturer Part#: |
ATS-16D-167-C1-R0 |
Price: | $ 3.12 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X20MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.82933 |
30 +: | $ 2.75289 |
50 +: | $ 2.60001 |
100 +: | $ 2.44705 |
250 +: | $ 2.29408 |
500 +: | $ 2.21761 |
1000 +: | $ 1.98820 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Application Field and Working Principle of ATS-16D-167-C1-R0
Heatsinks are thermal management tools designed to dissipate heat from components or systems that generates them. The ATS-16D-167-C1-R0 heatsink is designed for high-power applications. This type of heatsink is uses electricity to heat the rows or profiles that are mounted on top of them. This heat is then dissipated into the surrounding air.
The ATS-16D-167-C1-R0 heatsink features a low-profile design that allows for efficient air flow through the profile fins and over the electronics components being cooled. It has a high heat exchange rate of up to 168 watts/m2. Its dimensions are 16cm D x 16.7cm L x1cm H. This heatsink is made of aluminum and has a powder-coat finish. The profile fins have a wave-shaped profile that increases their ability to dissipate heat.
In addition, this type of heatsink has a mounting plate that allows for easy installation on a board in any orientation. This plate also distributes the heat evenly across the profile fins. This ensures that heat is evenly dispersed throughout the heatsink. The mounting plate also prevents vibration and shock from affecting the performance of the heatsink
When it comes to the working principle of this type of heatsink, there are two main components involved; the thermoelectric element and the ventilation. The thermoelectric element creates a temperature gradient across the heat sink, when the element is activated. This creates a thermal gradient which in turn, causes a convection current set up in the ventilation system of the heat sink. This convection current then disperses the heat generated by the electronics away from the components into the ambient air. The ATS-16D-167-C1-R0 heatsink also has a fan to direct the air generated by the convection current away from the component, thereby further enhancing the heat dissipation capability of the heatsink.
The ATS-16D-167-C1-R0 heatsink is ideal for cooling power amplifiers, laser diodes, semiconductor components, and other high-power electronic components. This type of heatsink is also widely used in industrial and laboratory settings, such as in security systems or industrial and automotive controls. It is also suitable for hardware intensive applications such as gaming PC\'s or cryptocurrency mining.
Overall, ATS-16D-167-C1-R0 is an ideal solution for any application that needs to dissipate a large amount of heat quickly. Its small form factor, low-profile design, and efficient heat dissipation will ensure that components and systems operate at optimal temperatures.
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