| Allicdata Part #: | ATS-16D-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-16D-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an integral part of electronics and embedded systems. Heat sinks help to prevent components from overheating by dissipating heat away from them. As technological advancements have been made, more efficient and powerful heat sink designs have been developed.
The ATS-16D-181-C3-R0 is a heat sink designed for use with mini and micro circuit boards. It is a lightweight yet powerful heat sink, composed of aluminum and anodized aluminum alloy. The anodized aluminum alloy allows for heat dissipation over a wide area, ensuring the component does not overheat. The anodized aluminum alloy is also corrosion-resistant, making the ATS-16D-181-C3-R0 a durable and reliable heat sink.
The ATS-16D-181-C3-R0 heat sink offers several advantages over traditional heat sinks. It is capable of dissipating heat over a large area, due to its unique design. This makes it an ideal choice for use in small circuits where dissipating heat over a large area is paramount. The heat sink also increases the efficiency of the circuit board, as it serves as an additional source of cooling. And since it is lightweight, the ATS-16D-181-C3-R0 can be easily transported and installed. These features make it popular among manufacturers of electronic products.
The application field and working principle of the ATS-16D-181-C3-R0 can be broken down into several steps. To start, the heat sink should be securely mounted onto the circuit board. This can be done with screws, nuts or rivets, depending on the type of circuit board being used. Once mounted, the heat sink will draw the heat away from the components and dissipate it away from the board. This will prevent the heat from affecting the performance of the components, allowing the circuit to operate at peak efficiency.
The material of the heat sink is also important to consider. Aluminum allows for more effective heat dissipation, due to its low coefficient of thermal expansion. Anodized aluminum alloy is also corrosion-resistant and able to withstand high temperatures. Since the ATS-16D-181-C3-R0 is made of anodized aluminum alloy, it is a suitable choice for use with mini and micro circuit boards.
In conclusion, the ATS-16D-181-C3-R0 is an efficient and reliable heat sink designed specifically for use with mini and micro circuit boards. It is composed of anodized aluminum alloy for increased corrosion-resistance and effective heat dissipation. It is ideal for dissipating heat over a large area to maximize the efficiency of the circuit board and component performance. Due to its lightweight and easy installation, it is also popular among manufacturers of electronic products.
The specific data is subject to PDF, and the above content is for reference