| Allicdata Part #: | ATS27096-ND |
| Manufacturer Part#: |
ATS-16D-183-C2-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-16D-183-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.92490 |
| 10 +: | $ 3.81717 |
| 25 +: | $ 3.60511 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management technology used in electronic devices has been advancing rapidly over the years. As devices become more compact and powerful, heatsinks are becoming more commonplace in order to dissipate heat quickly and efficiently. The ATS-16D-183-C2-R0 is a heatsink specifically designed for such devices, and it has unique features that make it an ideal choice for many applications.
The ATS-16D-183-C2-R0 is a low profile sintered fin heatsink with a copper base and aluminum fins. It has a height of only 16 mm, making it ideal for usage in confined spaces. The body of the heatsink is an extruded copper base which effectively conducts the heat generated out and away from the source. Its aluminum fins and copper base provide excellent thermal transfer from the device to ambient air. The fin construction of the ATS-16D-183-C2-R0 also ensures an effective dissipation of heat in a wide range of temperatures.
The sintered fins in the heatsink are shaped in a curved waveform to allow them to trap air for highest possible efficiency. This also makes the fins more resistant to dust and vibration, providing a more reliable and robust thermal solution. The copper base further enhances these features by increasing the effective surface area exposed to the heat source.
The ATS-16D-183-C2-R0 is suitable for a wide variety of electronic equipment, where size, weight and performance are primary concerns. Its application fields include, but are not limited to, main processors used in computers, temperature sensors, opto-electronic components, high emission LED arrays and power amplifiers used in motors and other drivetrain systems.
The ATS-16D-183-C2-R0 has plenty of features that make it an ideal thermal solution for many applications. Its height of 16 mm, aluminum fins with sintered construction and copper base make it one of the best heatsinks available. Additionally, it is also dust and vibration resistant, providing a reliable and robust thermal solution. All these features make the ATS-16D-183-C2-R0 an invaluable asset for a wide variety of circuits and applications.
The specific data is subject to PDF, and the above content is for reference
ATS-16D-183-C2-R0 Datasheet/PDF