| Allicdata Part #: | ATS27104-ND |
| Manufacturer Part#: |
ATS-16D-190-C2-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-190-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.37220 |
| 10 +: | $ 4.25628 |
| 25 +: | $ 4.02016 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are becoming increasingly important as power dissipation increases in many applications, especially those in the automotive, aerospace, defense, and medical industries. One of the most commonly used thermal solutions is a heat sink. A heat sink is a device used to disperse heat generated by a processing unit, such as a computer processor or an electronic component. Heat sinks are available in a variety of sizes, shapes, materials, and performance levels, and are available for nearly any application. The ATS-16D-190-C2-R0 is a an example of such a broad category of thermal solution.
The ATS-16D-190-C2-R0 is a high-performance heat sink designed to dissipate heat from any electronic device or computer processor. The heat sink is constructed from anodized aluminum and consists of two aluminum fins of 0.16mm thickness, measuring 190mm x 190mm. The ATS-16D-190-C2-R0 is designed with a high performance thermal interface that improves the ability to dissipate heat, thus providing additional protections of the electronic component from overheating. In addition, the ATS-16D-190-C2-R0 features a two-piece construction, allowing it to be easily installed in nearly any space.
The ATS-16D-190-C2-R0 is designed to be used in a variety of applications. It is an ideal solution for devices that require cooling due to high power dissipation, such as electrical control devices, industrial computers, and automotive electronics. It can also be used to dissipate heat generated in LED lighting fixtures, medical equipment, or telecommunications equipment. Additionally, the ATS-16D-190-C2-R0 is designed to provide superior heat dissipation performance even in extreme temperature environments.
The working principle of the ATS-16D-190-C2-R0 heat sink is based on the phenomenon of convection. Convection is the transfer of thermal energy through a fluid medium, such as air or water. The ATS-16D-190-C2-R0 utilizes convection to dissipate heat from the electronic component, allowing the device to maintain a safe operating temperature. Heat from the component is absorbed by the heat sink, which in turn dissipates the heat into the surrounding environment, thus reducing the temperature of the electronic device.
The ATS-16D-190-C2-R0 heat sink is designed to provide reliable and efficient thermal management for a variety of applications. With its anodized aluminum construction and two-piece design, it is ideal for applications that require cooling due to high power dissipation, such as electrical components, industrial computers, and medical equipment. Its high performance thermal interface and superior heat dissipation performance make it an ideal solution for devices that require cooling in extreme temperature environments.
The specific data is subject to PDF, and the above content is for reference