| Allicdata Part #: | ATS27114-ND |
| Manufacturer Part#: |
ATS-16D-20-C2-R0 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-20-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.52970 |
| 10 +: | $ 4.40685 |
| 25 +: | $ 4.16203 |
| 50 +: | $ 3.91734 |
| 100 +: | $ 3.67246 |
| 250 +: | $ 3.42763 |
| 500 +: | $ 3.18280 |
| 1000 +: | $ 3.12159 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal management is an essential component of managing the temperature of electronic components. Heat sinks are particularly important for helping to dissipate excessive heat away from printed circuit boards (PCBs) and other components. ATS-16D-20-C2-R0 is a heat sink, typically formed of metal or hard plastic, that helps to dissipate high levels of heat off-loaded electronic components. In this article, we will look at the ATS-16D-20-C2-R0 application field and working principle.
The ATS-16D-20-C2-R0 heat sink is mainly used in the harsh environments of industrial control, consumer electronics, and telecom applications. Its robust construction helps to ensure that it can withstand exposure to extreme temperatures and environments. The ATS-16D-20-C2-R0 heat sink is well suited for use in applications involving high ambient temperatures and features with high cooling performance.
It is manufactured with high-performance thermal transfer materials, such as cast aluminum, which distributes heat evenly across its surfaces. The ATS-16D-20-C2-R0 includes a variety of features to improve cooling performance, such as ventilated fins for increased airflow, and cast inlets and outlets to direct the air to the components. It also offers robust plastic fasteners, which attach to the PCB securely without the use of solvents.
The working principle behind the ATS-16D-20-C2-R0 is that it is designed to dissipate up to 8 Watts (Air Flow) of heat into the ambient air, making it ideal for transferring high levels of heat from a variety of components. The design also helps to ensure that the electrical continuity of the components is preserved. To further improve cooling efficiency, the ATS-16D-20-C2-R0 includes a heat pipe which helps to transfer excess heat away from the PCB quickly and effectively.
The ATS-16D-20-C2-R0 also includes a variety of features to ensure reliability, such as an epoxy bonding technique which ensures that the heat sink stays securely attached even when exposed to mechanical and electrical interference. Additionally, its high durability and resistance to corrosion makes it an ideal choice for use in harsh environments.
Overall, the ATS-16D-20-C2-R0 heat sink is an excellent choice for applications requiring an effective and reliable solution for dissipating high levels of heat away from printed circuit boards and components. Its robust construction and efficient working principle help to ensure that it provides superior thermal management performance.
The specific data is subject to PDF, and the above content is for reference