ATS-16D-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThe thermal-heat sink ATS-16D-20-C3-R0 is an advanced thermal management solution for electronic systems. It is designed for cost-effective heat dissipation and improved thermal efficiency. The ATS-16D-20-C3-R0 utilizes efficient thermal heat sink structures to ensure high-performance heat dissipation. The advanced design also offers high operational reliability and durability to ensure long-term performance.Application FieldThe ATS-16D-20-C3-R0 is primarily for dissipating heat created from heat-generating components in electronic systems. It can also be used to help cool down the internal temperature of an electronic device, particularly during heavy usage or under extreme temperature conditions. The thermal-heat sink is particularly designed in order to dissipate the heat generated at the source while still working in a more cost-effective solution.The ATS-16D-20-C3-R0 thermal-heat sink is an ideal choice for use in commercial and industrial applications where reliable, cost-effective cooling performance is essential. It can also be employed in a wide range of consumer electronics to ensure the smooth and effective operation of devices. This includes smart devices, home theatre systems, digital audio players, gaming consoles and computers.Working PrincipleThe ATS-16D-20-C3-R0 thermal-heat sink works by dissipating the heat generated from the electronic components on board. This heat is then efficiently conducted away from the source to the external heat sink and expelled to the environment through convection.The heat sinks are designed for maximum cooling efficiency and optimal performance. The heat pipe integrated into the structure of the ATS-16D-20-C3-R0 further boosts the dissipation of the heat generated from the components, as it redistributes the heat uniformly over the entire surface of the heat sink. The thermal-heat sink is constructed using highly efficient fins, which efficiently draw in the heat and dissipates it away from the system.AdvantagesThe ATS-16D-20-C3-R0 thermal-heat sink offers a number of benefits over conventional cooling solutions. The highly efficient fin structure ensures maximum cooling efficiency, reducing the peak temperatures of the components and maintaining optimal thermal performance. The improved thermal performance helps extend the life cycle of the device and reduce wear and tear.The fin design also dissipates the noise generated by the fans, ensuring a quieter environment for the user. The compact size of the ATS-16D-20-C3-R0 also saves valuable space within the chassis, allowing for more efficient enclosure designs. The improved durability and reliability also ensures long-term performance with minimal wear and tear.ConclusionThe ATS-16D-20-C3-R0 thermal-heat sink is an ideal choice for dissipating heat generated from electronic components in commercial and industrial applications. Its highly efficient fin structure ensures maximum cooling efficiency, reducing peak temperatures and increasing the life cycle of the device. The improved thermal performance also ensures quiet operation with less noise. The compact design also saves valuable space and helps reduce enclosure costs.

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