| Allicdata Part #: | ATS-16D-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-16D-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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As technology advances, various applications that require reliable energy conduction become increasingly prominent. Heat sinks are essential components in many electronics equipment, as they effectively dissipate thermal energy to optimize electrical components’ functioning. ATS-16D-200-C3-R0 is one such heat sink designed to deliver excellent thermal performance and efficiency.
Application Field
The ATS-16D-200-C3-R0 is specifically designed for use in a variety of high-powered, thermally-challenging applications due to its superior capacity for heat dissipation. It is ideal for applications that require superior cooling, including but not limited to, telecommunications servers, high-frequency radio, power supplies, and heatsinks.
Working Principle
When thermal energy has to be dissipated, the heat sink ATS-16D-200-C3-R0 capitalizes on the concept of convection transport, which is the flow of heat energy from a higher temperature to a lower temperature medium. This thermal management device uses air fins to promote laminar airflow in conjunction with conductive materials to dissipate the thermal energy generated by the electrical components. The ATS-16D-200-C3-R0 is also fitted with an innovative heat spreader, which further increases its surface area to enhance the thermal performance of the device. The heat energy conducted away from the electrical components is then dispersed into the surrounding environment.
To maximize the heat dissipation efficiency of the ATS-16D-200-C3-R0, the fins and spreader are arranged in a stacked configuration, meaning the airflow generated envelops the entire heat sink. This allows for efficient cooling of the electrical components by providing an expedited transfer of heat away from the heat-generating elements.
The ATS-16D-200-C3-R0 is designed with a half-hexagon shape, which provides easy and quick installation for various applications. Thanks to its compact shape, the device can be installed in a wide variety of applications, making it suitable for a broad range of applications.
To further ensure excellent thermal performance and maximum reliability, the ATS-16D-200-C3-R0 is tested and verified to meet stringent industry standards. The heat sink is designed to provide excellent efficiency even under demanding and harsh conditions, making it ideal for various applications, from automotive to telecoms.
In conclusion, the ATS-16D-200-C3-R0 heat sink is an innovative product that offers reliable thermal dissipation and maximum efficiency. It is designed to provide effective cooling in a variety of thermally-challenging applications, making it suitable for a broad range of industry applications. Moreover, its compact shape and quick installation offers convenience and ease of use.
The specific data is subject to PDF, and the above content is for reference