| Allicdata Part #: | ATS-16D-27-C1-R0-ND |
| Manufacturer Part#: |
ATS-16D-27-C1-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-27-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-16D-27-C1-R0 is an advanced thermal heat sink device designed for the efficient transfer and dissipating of heat generated by components such as electrical, computing, and other electronic devices. Designed to protect components, including power transistors, from damaging heat, the ATS-16D-27-C1-R0 has a wide range of applications in various industries.
Heat sinks allow for more efficient operation of an electrical device by utilizing the natural properties of convection, radiation, and/or conduction. This type of thermal solution does not utilize power for temperature control or active cooling, but instead acts passively to cool the component in question. The goal of thermal management is to maintain component temperatures within an acceptable operating range and prevent component malfunction. The ATS-16D-27-C1-R0 has been designed to provide a reliable, efficient, and low-cost solution in order to meet these goals.
The ATS-16D-27-C1-R0 utilizes a patented mounting system that allows for the quick, easy, and secure installation of the device. This method eliminates the need for both mechanical and adhesive attachments which can decrease product life and reliability. The ATS-16D-27-C1-R0 also employs a unique heat-conducting material that is specifically designed to dissipate and spread heat quickly and evenly. The superior heat-sinking properties of this material, combined with its low profile, make it an ideal thermal management solution.
The ATS-16D-27-C1-R0 is compatible with a wide range of components, including voltage regulators, microprocessors, and voltage control components. It is also designed to be compatible with a wide range of enclosures, including plastic, metal, and sealed containers. Additionally, the ATS-16D-27-C1-R0 can be easily customized to fit a variety of applications.
The ATS-16D-27-C1-R0 features a high-quality design and construction, providing an effective and reliable solution for thermal management needs. Its superior heat-transfer performance allows for long-term operation of components at optimal temperatures, ensuring maximum equipment performance. Additionally, the ATS-16D-27-C1-R0 is designed to be both cost-effective and highly efficient. As such, it is an ideal choice for a variety of applications requiring thermal management.
The specific data is subject to PDF, and the above content is for reference