| Allicdata Part #: | ATS-16D-41-C1-R0-ND |
| Manufacturer Part#: |
ATS-16D-41-C1-R0 |
| Price: | $ 6.18 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-41-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.56353 |
| 30 +: | $ 5.25462 |
| 50 +: | $ 4.94550 |
| 100 +: | $ 4.63636 |
| 250 +: | $ 4.32727 |
| 500 +: | $ 4.01818 |
| 1000 +: | $ 3.94091 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components for most modern electronic devices. Their primary purpose is to dissipate or manage the heat generated by the device, either by passively spreading it away from its source or actively aiding the device in heat transfer. While the details of their design and operation may vary depending on the application, there are some common features shared by most heat sinks. The ATS-16D-41-C1-R0 is one such product that uses this type of technology in order to provide a wide range of thermal management solutions.
The ATS-16D-41-C1-R0 is a type of heat sink specifically designed for circuit boards. It is a combination of a heat sink and a thermal gap filler material, allowing it to provide heat transfer capabilities for both single and multi-layer PCBs. The primary goal of this product is to improve the efficiency and reliability of the PCB without compromising other aspects of the board.
The ATS-16D-41-C1-R0 utilizes a combination of thermal management methods in order to effectively control heat transfer. First, it is designed with the intention to spread the heat away from its source. The heat sink’s surface is designed to be highly thermally conductive, allowing it to effectively draw heat away from its source. This is supplemented by the use of metal fins or pin-fin fins which help to more actively dissipate the heat. Secondly, the ATS-16D-41-C1-R0 also includes an attached thermal gap filler material that can help to better manage the heat within the board. This gap filler material helps to enhance the thermal conductivity of the board, allowing it to be more efficient in heat dissipation.
The ATS-16D-41-C1-R0 is a versatile heat sink which can be used in a variety of applications. In general, it is most commonly used in high-powered applications, such as industrial or medical electronics, where heat must be efficiently and reliably managed. Additionally, it is well-suited for other applications such as consumer electronics, automotive electronics, military, and aerospace applications.
The ATS-16D-41-C1-R0 excels in thermal management due to its combination of features such as its large thermal conductivity and its unique thermal gap filler material. The large thermal conductivity of the base metal allows heat to be effectively spread away from its source, while the specially designed gap filler provides the necessary additional thermal conductivity required to manage the heat internally. This combination of features results in a product that is both reliable and efficient, making it an ideal choice for thermal management in a variety of applications.
The specific data is subject to PDF, and the above content is for reference