ATS-16D-42-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-16D-42-C2-R0-ND

Manufacturer Part#:

ATS-16D-42-C2-R0

Price: $ 7.15
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X22.86MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16D-42-C2-R0 datasheetATS-16D-42-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.43104
30 +: $ 6.07383
50 +: $ 5.71662
100 +: $ 5.35928
250 +: $ 5.00200
500 +: $ 4.64471
1000 +: $ 4.55539
Stock 1000Can Ship Immediately
$ 7.15
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.31°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for proper functioning of almost any electronic device. Heat sinks and other thermal solutions are designed to conduct heat away from components to prevent them from overheating. ATS-16D-42-C2-R0 is a type of thermal - heat sink solution used to manage the heat generated within different types of electronic devices.

The ATS-16D-42-C2-R0 is a high-performance aluminum heatsink, designed with a modified fin shape and larger fin width for more effective heat dissipation. It features an innovative flat or curved plate design with an advanced thermal resistance improvement. The flat plate design has a larger surface area, making it more capable of dissipating heat using natural or forced convection. The curved plate design can provide better thermal performance by increasing the amount of air that passes through the fins, and also by circulating hot air internally.

The ATS-16D-42-C2-R0 is designed for use in a wide range of applications. It can be used for thermal management in medical and industrial electronic devices and systems, such as computer systems, servers, instrumentation, power supplies, and process control systems. It can also be used in electro-mechanical and laser cooling applications.

In terms of its working principle, the ATS-16D-42-C2-R0 heatsink absorbs the heat generated by electronic components and dissipates it away using convection, radiation, or evaporation. Convection is the process of transferring heat from the component to the heatsink via air movement, while radiation is the process of transferring heat without direct contact between the component and the heatsink. Evaporation is the process of exchanging heat between liquid and air, or between the air surrounding the heatsink and the component.

The ATS-16D-42-C2-R0 heatsink also has the ability to control the temperature of the component by actively cooling the component as opposed to just dissipating the heat away. This is done by mounting the heatsink onto the component, which can be done with screws or adhesive. The heat generated by the component is then conducted into the heatsink, where it is quickly absorbed and dissipated away.

The ATS-16D-42-C2-R0 is both a passively and actively cooled thermal solution. It can be used in both active and passive cooling systems, depending on the thermal requirements of the application. In active cooling systems, a fan or other air source is used to direct a stream of air through the heatsink to remove the heat generated by the components, while passive cooling systems rely solely on conduction and convection.

The ATS-16D-42-C2-R0 is a thermally efficient heat sink that can provide excellent temperature control for electronic devices. It is designed for easy installation and provides an excellent solution for thermal management. The innovative design features of the ATS-16D-42-C2-R0 provide greater cooling efficiency, increasing the life of the electronic components and overall system reliability.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics