ATS-16E-01-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a commonly used method to regulate, dissipate and remove heat from electronic components and circuits. One of the most common Thermal - Heat Sinks in the market is the ATS-16E-01-C3-R0 thermal heat sink. The purpose of this article is to present an in-depth analysis of the ATS-16E-01-C3-R0 thermal heat sink, from its application field and working principle to its installation and operation methods. The ATS-16E-01-C3-R0 is a small, fully encased heat sink designed for use with medium power transistors and integrated circuits. This heat sink is composed of pure aluminum and provides efficient heat transfer and dissipation of heat in devices ranging from logical gates to industrial use. This thermal heat sink is also capable of providing active cooling by featuring a thermo-electric device that helps in controlling the ambient temperature of the device. It is resistant to wear and corrosion and has very good electrical conductivity. The application field of the ATS-16E-01-C3-R0 is usually for small and moderate power devices such as transistors, logic gates and industrial electronics. This heat sink should be used by professionals as they are equipped with the appropriate knowledge when it comes to installing and safely operating the heat sink. Therefore, this heat sink should mainly be used in industrial settings or in research and development as it requires expertise. The ATS-16E-01-C3-R0 has a unique working principle as it is equipped with an integrated thermal electric device that helps it perform its cooling process. The thermal electric device changes its thermal properties depending on the workload applied to the component being cooled. This creates a cooling effect where heat is diverted away from the device being cooled and into the thermal heat sink. This helps create an environment of better cooling action and a more efficient environment for the device.The installation of the ATS-16E-01-C3-R0 is quite simple as it follows some basic instructions that should be followed by the professionals working with it. Before installation, the first step is to clean the surface area and apply the recommended thermal compounds to the device for proper heat transfer. After the surface area is prepared, the heat sink should then be placed onto the component and installed with the proper pressure and connection. Once securely installed, the thermo-electric device can be plugged in with the included wiring, and the cooling process can start. The operation of the ATS-16E-01-C3-R0 is fairly easy to understand as its main focus is the thermal electric device that is required for its cooling process. The thermoelectric device helps in regulating the temperature of the device being cooled by taking up the heat from the component, and dissipating it through the heat sink. This helps keep the device\'s temperatures low and efficient cooling can now take place. In addition, the heat sink also helps in keeping the device secure as it has high electrical conductivity and good wear and corrosion resistance. Overall, the ATS-16E-01-C3-R0 thermal heat sink is an ideal choice for professionals looking for a reliable and efficient heat sink that can provide active cooling for their components. Its working principle and installation is quite simple and it can provide a good environment for the components it is cooling. Furthermore, its high electrical conductivity and wear and corrosion resistance makes it a great choice when it comes to properly cooling and maintaining the integrity of the components.

The specific data is subject to PDF, and the above content is for reference