| Allicdata Part #: | ATS-16E-04-C1-R0-ND |
| Manufacturer Part#: |
ATS-16E-04-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-04-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly critical in the development of electronics devices. Heat sinks are designed to dissipate heat generated by electronic components and protect them from thermal damage. ATS-16E-04-C1-R0 is a type of heat sink that consists of a base, a heat spreader, and a fin structure.The base of the ATS-16E-04-C1-R0 is made of aluminum and is designed to provide a flat heat transfer interface between the component and the heat sink. The heat spreader is designed to enhance the heat transfer from the component to the base of the heat sink. It is made of aluminum and helps to dissipate heat away from the component quickly and evenly. The fin structure is designed to increase the total heat dissipation area of the heat sink and improve its heat transfer efficiency. The fin structure consists of a series of thin, closely arranged aluminum fins which allow for improved air convection.The ATS-16E-04-C1-R0 heat sink is designed for use in high-power applications such as power converters, motor drives, servers, and power supplies. Its high heat dissipation capability and low profile design make it ideal for applications where space is at a premium. The heat sinks are designed with large fin area for increased heat transfer, as well as optimized fin pitch and surface area for maximum performance.When designing an application with the ATS-16E-04-C1-R0 heat sink, it is important to consider the thermal resistance between the component and the heat dissipating surfaces of the heat sink. This can be accomplished through the use of thermal interface materials. These materials act as a bridge between the component and the heat sink, creating a more efficient thermal path for heat to be transferred from the device to the heat sink.The ATS-16E-04-C1-R0 heat sink is an efficient and compact thermal management solution that is ideal for high-power applications. Its base and heat spreader provide a flat heat transfer interface between the component and the heat sink, and its fin structure increases the heat dissipating area of the heat sink. In addition, the use of thermal interface materials ensures ideal thermal resistance between the component and the heat sink.
The specific data is subject to PDF, and the above content is for reference