| Allicdata Part #: | ATS27196-ND |
| Manufacturer Part#: |
ATS-16E-04-C2-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-04-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.50280 |
| 10 +: | $ 3.41208 |
| 25 +: | $ 3.31960 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal solutions used by many modern electronic components in order to control and dissipate heat away from sensitive components. The ATS-16E-04-C2-R0 is a particular heat sink designed for use with power semiconductor devices and other sensitive components, allowing them to operate at optimal thermal conditions. This article will look at the applications and working principles of the ATS-16E-04-C2-R0 heat sink.
What is the ATS-16E-04-C2-R0 Heat Sink?
The ATS-16E-04-C2-R0 is a thermal solution designed for use with power semiconductor components. It is made of aluminum, which is a strong but lightweight material that dissipates up to three times the heat generated by the device it is attached to. The heat sink also provides a cooling effect, allowing components to remain at their optimal operating temperatures. The heat sink is available in various sizes, depending on the type of component needing cooling.
What Are the Applications of the ATS-16E-04-C2-R0 Heat Sink?
The ATS-16E-04-C2-R0 can be used in a wide range of applications, including the cooling of power semiconductor components, CPU’s, GPUs, LED’s, and more. It can also be used in applications that produce a large amount of heat, such as automotive applications. Additionally, the heat sink can be used for cooling other electrical components, such as transformers and motors.
How Does the ATS-16E-04-C2-R0 Heat Sink Work?
The ATS-16E-04-C2-R0 heat sink works by transferring heat away from the component it is attached to. It does this by conduction, convection, or both. Conduction is the transfer of heat from one object to another through direct contact. This is why the heat sink is attached directly to the component to be cooled. Convection is the transfer of heat from one object to another through the air. The heat sink itself has a large surface area, allowing it to transfer more heat away from the component. Additionally, the heat sink has an intricate design which allows it to draw in air from around it and consequently expel hot air.
Conclusion
The ATS-16E-04-C2-R0 heat sink is an effective and efficient solution for cooling power semiconductor devices and other sensitive components. It can withstand high temperatures and provide the necessary cooling effect for components to remain at their optimal operating temperature. Its ability to transfer heat by conduction and convection makes it an ideal thermal solution for many applications.
The specific data is subject to PDF, and the above content is for reference