![ATS-16E-10-C3-R0 Allicdata Electronics](https://files.allicdata.com/upload/common/default.jpg)
Allicdata Part #: | ATS-16E-10-C3-R0-ND |
Manufacturer Part#: |
ATS-16E-10-C3-R0 |
Price: | $ 3.93 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.57399 |
30 +: | $ 3.37554 |
50 +: | $ 3.17696 |
100 +: | $ 2.97845 |
250 +: | $ 2.77989 |
500 +: | $ 2.58133 |
1000 +: | $ 2.53168 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are an important piece of technology that is used in many electronic applications to dissipate heat and protect the components within the system. ATS-16E-10-C3-R0 is a heat sink manufactured by Anvil Technologies. The ATS-16E-10-C3-R0 is a very versatile heat sink that can be used in a variety of applications. It is a large, rectangular heat sink that features an efficient thermal interface layer, making it ideal for dissipating heat.
The ATS-16E-10-C3-R0 is designed to dissipate heat rapidly and efficiently. It is constructed of an aluminum base with high thermal conductivity, which helps to dissipate heat quickly and evenly. The heat sink also features a large aluminum fin array that is designed to dissipate the heat away from the component quickly. The aluminum fins are also designed with a low profile that minimizes airflow resistance and also provides a good thermal balance.
The ATS-16E-10-C3-R0 is an ideal heat sink in thermal management applications that require maximum heat dissipation. It can be used in systems that require a large amount of cooling, such as desktop computers, servers, communication racks, or other high-powered electronic applications. The ATS-16E-10-C3-R0 is designed to work efficiently even in areas with a high ambient temperature, such as outdoors or in hot industrial environments.
The ATS-16E-10-C3-R0 heat sink uses a highly efficient thermal interface layer that helps to dissipate heat more quickly and effectively. This thermal interface layer is made from a material that has a high thermal conductivity, allowing heat to flow quickly and evenly away from the component. This helps the heat sink to work even better in areas with higher ambient temperatures.
The ATS-16E-10-C3-R0 heat sink features a variety of mounting options, such as vertical or horizontal mounting, to ensure that it can be used in any system. It is also designed to make installation a breeze, as it comes with all the necessary mounting hardware. The mounting holes are machined to exact specifications to ensure a secure and reliable connection.
The ATS-16E-10-C3-R0 heat sink is designed for maximum efficiency and safety. It features a rolled edge design that increases its strength and rigidity. This makes it an ideal solution for systems that need to dissipate high levels of heat. Additionally, the heat sink is coated with a corrosion-resistant coating to ensure it will last for many years.
The ATS-16E-10-C3-R0 heat sink is an excellent solution for a variety of thermal management applications. Its efficient design ensures that it can dissipate heat quickly and effectively, even in high-temperature environments. Its versatility and durability make it an ideal choice for system designers and engineers looking for a reliable and efficient heat management solution.
The specific data is subject to PDF, and the above content is for reference