| Allicdata Part #: | ATS-16E-103-C1-R1-ND |
| Manufacturer Part#: |
ATS-16E-103-C1-R1 |
| Price: | $ 4.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-103-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.87513 |
| 30 +: | $ 3.65967 |
| 50 +: | $ 3.44434 |
| 100 +: | $ 3.22906 |
| 250 +: | $ 3.01379 |
| 500 +: | $ 2.79852 |
| 1000 +: | $ 2.74471 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.64°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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Thermal – Heat Sinks
Heat sinks are an important part of thermal management. They are used to absorb and dissipate heat from various sources, and are essential to ensure that systems and components are functioning safely and optimally. The ATS-16E-103-C1-R1 heat sink is designed to accommodate heat generated by a wide range of electronics components.Applications
The ATS-16E-103-C1-R1 heat sink is designed for use in a multitude of applications. It is an energy efficient device that is well-suited for cooling small to medium sized electronics components and devices such as CPUs, GPUs, printed circuit boards, and power supply units. It could be used in a range of consumer and industrial applications such as telecommunications, computer networks, and data centers.Design
The ATS-16E-103-C1-R1 heat sink has a two-piece aluminum construction with an integrally bonded copper base. The copper base acts as an effective heat conductive layer which helps to quickly dissipate the heat generated by electronics components. The unit also has an air-flow directing system which helps to ensure that air flows in the most efficient way possible. In addition, the device is designed with a T-shape and venting pattern at the top for maximum heat dissipation.Working Principle
The ATS-16E-103-C1-R1 heat sink is designed to work in combination with the natural laws of thermal management. Heat generated by electronics components is transferred to the copper base, which acts as an efficient thermal conductor. The heat is then dissipated through the air-flow directing system, which channels the air through a number of vents. As the air passes through the vents, it is cooled and helps to cool the system. The two-piece construction ensures that the air is able to freely circulate and efficiently cool the components.Conclusion
The ATS-16E-103-C1-R1 heat sink is an energy efficient and effective device for thermal management. Its two-piece construction, integrally bonded copper base, and air-flow directing system make it an ideal choice for cooling small to medium sized electronics components and devices. It is designed to work in accordance with the natural laws of thermal management, ensuring that the electronics components are kept at the optimal temperature and functioning safely and efficiently.The specific data is subject to PDF, and the above content is for reference
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