ATS-16E-12-C1-R0

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Heat sinks are crucial components of electronics, providing surface areas that act as conduits for the naturally occurring process of heat transfer, convection. Heat sinks, like the ATS-16E-12-C1-R0, provide a direct path for heat to travel away from areas of high temperature, improving the performance and preventing potential damage of the equipment they are incorporated in. This process is instrumental in ensuring the long-term successful functioning of many electrical items.

The ATS-16E-12-C1-R0 is a combination of high performance heat sink and efficient cooling fan. It is designed to handle up to 16 watts of power while dissipating its own thermal energy, allowing you to reduce the temperature of your device\'s operating environment. The fan operates with a fixed speed of 3200 RPM and the entire unit measures 120 mm (L) x 111 mm (W) x 58 mm (H). With an overall weight of 0.86 kg, the ATS-16E-12-C1-R0 is simple to install and is ideal for most small form factor applications.

The ATS-16E-12-C1-R0 also features a unique design with Aluminum Extrusion technology, which allows maximum airflow through its fins. This design means that more air is able to pass over the surface of the heatsink, allowing significantly more heat to be transferred away from the component than if a traditional fan motor were used. Ultimately, this should allow a device to run cooler and more efficiently, as the heat produced by the device is dissipated faster and more effectively.

When it comes to the working principle of the ATS-16E-12-C1-R0, it utilizes three fundamental principles of heat transfer - conduction, convection and radiation. Heat is first transferred from the source to the sink in the form of conduction, as the heat energy is transferred from one solid to another. This occurs when the heat waves travel through matter from the higher temperature source to the lower temperature sink. For most devices, this conduction process is enhanced by fins on the surface of the heat sink that increase the surface area in contact with the source, allowing more heat to be effectively transferred.

Next, the sink produces its own thermal energy which is then radiated into the air. This occurs when electromagnetic waves are emitted, transferring heat away from the device and into the surrounding atmosphere. Radiation is a more efficient means of heat transfer as it is more versatile than the other two methods.

Finally, convection also aids in heat transfer away from the device. This occurs when the fan attaches to the sink and forces a stream of warm air from the source, over the surface of the heat sink, exchanging thermal energy with the environment. This method is effective for large heat transfer applications, like servers, but can also be used to supplement conduction and radiation for ATS-16E-12-C1-R0 applications.

Overall, the ATS-16E-12-C1-R0 provides an optimal thermal solution for small form factor applications. It features Aluminum Extrusion technology which allows for maximum airflow, providing the highest level of heat transfer. Moreover, the combination of conduction, convection and radiation ensures that the ATS-16E-12-C1-R0 is an effective and efficient means of preventing heat buildup, ultimately maximizing the lifespan of a device.

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