ATS-16E-12-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS27224-ND

Manufacturer Part#:

ATS-16E-12-C2-R0

Price: $ 4.16
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16E-12-C2-R0 datasheetATS-16E-12-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.78000
10 +: $ 3.67794
25 +: $ 3.47382
50 +: $ 3.26957
100 +: $ 3.06520
250 +: $ 2.86086
500 +: $ 2.65651
1000 +: $ 2.60542
Stock 1000Can Ship Immediately
$ 4.16
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are an essential part of electronics design, as components generate excessive temperature in use, leading to reduced efficiency and, in the worst case, damage to the device. The ATS-16E-12-C2-R0 thermal heat sink is a reliable, effective, and versatile solution for controlling temperatures in electronics applications. This article explains the application field and working principle of the ATS-16E-12-C2-R0 thermal heat sink.

Application Field of the ATS-16E-12-C2-R0 Thermal Heat Sink

The ATS-16E-12-C2-R0 thermal heat sink is designed to provide a reliable and effective solution for controlling temperatures in a range of electronics applications. The heat sink is particularly suitable for applications requiring high thermal conductivity and low resistance to heat transfer. This makes the ATS-16E-12-C2-R0 an ideal solution for LED lighting, automotive electronics, and power electronics applications.

Working Principle of the ATS-16E-12-C2-R0 Thermal Heat Sink

The ATS-16E-12-C2-R0 thermal heat sink utilizes a combination of technologies to provide an efficient and effective solution for thermal management in electronics applications. At the heart of the system is the heat sink itself, which is composed of a corrosion resistant aluminum alloy with a large area of contact with the component in need of cooling. This aluminum alloy provides a high thermal conductivity and low resistance to heat transfer, making it an ideal material for heat sink applications.

The heat sink also features an integrated air flow system, which helps to efficiently dissipate heat away from the component. This system utilizes a series of vanes arranged in a spiral pattern to create a channel through which air can flow and carry away heat. The air flow system also helps to reduce the overall noise levels generated by the cooling system.

Finally, the ATS-16E-12-C2-R0 thermal heat sink is equipped with a series of fins on the outside of the heat sink. These fins help to disperse heat away from the component, allowing the heat sink to be mounted in a variety of orientations and locations. This allows the thermal management application to be tailored to a specific need or application.

Conclusion

The ATS-16E-12-C2-R0 thermal heat sink is an efficient, reliable and versatile solution for controlling temperatures in a range of electronics applications. Its combination of large area of contact, a corrosion resistant aluminum alloy, an integrated air flow system, and a series of fins ensures that the heat sink can effectively manage temperature in a range of locations and orientations. As such, the ATS-16E-12-C2-R0 is an ideal solution for LED lighting, automotive electronics, and power electronics applications.

The specific data is subject to PDF, and the above content is for reference

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