| Allicdata Part #: | ATS-16E-122-C3-R0-ND |
| Manufacturer Part#: |
ATS-16E-122-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-122-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The thermal-heat sink ATS-16E-122-C3-R0 is used in a number of applications such as technology, electronics, and automotive industries. It is designed to dissipate heat from processor-based equipment and other electronic components, and to ensure optimal operation and reliability.
The heat sink utilizes the principles of thermal conduction, which involve the transfer of heat from one object to another. Heat is transferred from the processor-based equipment and other components through the heat sink in the form of thermal energy. The thermal energy is dissipated from the heat sink to its environment through a process of convection, where cooler air is circulated around the sink.
The thermal-heat sink features a unique design with precision machined aluminum fins that are specifically engineered to maximize heat conductivity and dissipate heat from processor-based equipment and other components. The fins are arranged in a circular formation and are spaced out evenly to ensure uniform air flow and to optimize heat dissipation. In addition, the fins are also designed to conform to the contours of the processor-based equipment, allowing for optimal contact and more efficient thermal conduction.
The heat sink also utilizes a patented thermal interface material (TIM) that is designed to fill the gap between the processor-based equipment and the heat sink, improving the thermal joint between the two components. This helps to reduce the amount of heat being produced and ensures the maximum thermal dissipation from the processor-based equipment.
The ATS-16E-122-C3-R0 thermal-heat sink is designed for use in technology, electronic, and automotive industries. It is able to dissipate heat from processor-based equipment and other components quickly and efficiently, helping to ensure optimal operation and reliability. With its unique design and patented TIM, the thermal-heat sink is an ideal choice for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference