| Allicdata Part #: | ATS-16E-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-16E-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-16E-139-C1-R0 application field and working principle
The application field and working principle of ATS-16E-139-C1-R0 thermal heat sink is widely used in consumer electronics, communication devices, embedded machines, power supplies and other places that require thermal management cooling solutions. This thermal heat sink works on the principle of natural convection cooling, as it is made of aluminum and other materials with good heat dissipation properties. The thermal heat sink provides an efficient way of transferring heat away from the device, through the fins on the upper section of the heat sink.
The ATS-16E-139-C1-R0 Thermal Heat Sink is made from lightweight aluminum and copper alloys, making it more durable and reliable than other heat sinks available in the market. It has a wide range of cooling capacities and features thermal performance characteristics, such as low thermal resistance, excellent heat dissipation, and consistent temperature maintenance. The advanced design technology provides superior thermal efficiency, offering greater power capacity and longer service life.
The ATS-16E-139-C1-R0 thermal heat sink features a unique heat pipe and cooling fan combination. The heat pipe helps to radiates the heat away from the device, while the fan helps to distribute the heat away from the middle of the heat sink. The combination of heat pipe and fan helps to maintain the temperature of the device, ensuring its long-term reliability and stability.
The ATS-16E-139-C1-R0 thermal heat sink is equipped with a heat-dissipating cover, which helps keep dust and dirt away from the device. The heat-dissipating cover also helps to dissipate additional heat, ensuring that the device is always operating at optimal temperatures. Additionally, the heat-dissipating cover helps to protect the device from any possible damage.
The ATS-16E-139-C1-R0 thermal heat sink is designed to be compatible with a wide range of devices and applications. It is equipped with an easy-to-use installation interface, which enables users to quickly mount the device onto various surfaces. The installation process is simple and straightforward, allowing users to quickly install the heat sink. Additionally, the installation interface provides users with a secure and high-performance connection, ensuring that the device is tightly secured against any potential external interference.
In conclusion, the ATS-16E-139-C1-R0 thermal heat sink is an efficient and reliable cooling solution for many types of devices, especially those used in consumer electronics, communication devices, embedded machines, and power supplies. The design technology provides superior thermal performance, allowing the device to maintain optimal temperatures and performance for a long duration. Additionally, its easy-to-install interface makes it ideal for many applications, allowing users to quickly mount and secure the device onto a range of surfaces.
The specific data is subject to PDF, and the above content is for reference