| Allicdata Part #: | ATS27261-ND |
| Manufacturer Part#: |
ATS-16E-153-C2-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-153-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.75480 |
| 10 +: | $ 3.65526 |
| 25 +: | $ 3.45215 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential to ensure optimum performance of an electronic device. Heat sinks are a critical part of the thermal management strategy, using thermal energy to dissipate and regulate the temperature of a component. The ATS-16E-153-C2-R0 is a compact, high performance heat sink engineered for reliable thermal management of a variety of electronic components.
The ATS-16E-153-C2-R0 is constructed from extruded aluminum, offering superior thermal conduction and efficient heat dissipation. The fin-like construction of the heat sink also increases the surface area, leading to significantly increased heat transfer capabilities.
The ATS-16E-153-C2-R0 is designed with an optimized profile, enabling air intake and exhaust for improved airflow. The low profile design also increases convenience by allowing the heat sink to be mounted in the tightest of areas. Additionally, the heat sink is corrosion resistant and is available with a variety of mounting options for compatibility with a range of components.
The ATS-16E-153-C2-R0 is designed to be used in a variety of applications requiring effective thermal management such as servers, storage, communications, medical devices, and industrial equipment. The heat sink is suitable for components such as field programmable gate arrays, voltage regulators, and controllers. Additionally, it is also designed to handle high loads and high temperature applications.
The working principle of the ATS-16E-153-C2-R0 is based on the principles of conduction and convection. Heat generated by the component is conducted away from the component via the heat sink, and then dissipated by the fins through convection. To achieve optimum performance, the fins must be evenly spaced such that air can pass through evenly and effectively cool the component.
The ATS-16E-153-C2-R0 is backed by ATS’s extensive warranties and product support, so customers can be confident in their purchase. With its efficient thermal performance and the highest build quality, the ATS-16E-153-C2-R0 is an ideal solution for reliable thermal management of a variety of electronic components.
The specific data is subject to PDF, and the above content is for reference