| Allicdata Part #: | ATS-16E-161-C3-R0-ND |
| Manufacturer Part#: |
ATS-16E-161-C3-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-161-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-16E-161-C3-R0 is a thermal solution widely used in many industries. This product features excellent thermal performance and a wide range of applications, making it a popular choice for thermal management solutions.
The ATS-16E-161-C3-R0 is a finned heat sink, which is a type of thermal solution. It is made up of a baseplate and a set of fins, which increase the surface area of the device to increase the rate of heat exchange between the device and its surroundings. This increases the efficiency of the thermal solution.
The heat sink works by dissipating the heat created in the device it is used with. The fins act as a large surface area that increases the rate of heat loss. The baseplate is made of heat-resistant material and it has some additional features, such as a heat dissipation thermal pad and thermal interface materials, that help to further increase the thermal performance of the heat sink.
The ATS-16E-161-C3-R0 has a wide range of applications. It is used in many different types of electronic devices, including computers, laptops, tablets, phones, and other consumer electronics. It is also used in a variety of industrial applications, such as in automotive, medical, and energy sectors.
The ATS-16E-161-C3-R0 is designed to provide efficient and reliable thermal performance. It is highly efficient in dissipating heat, making it a great choice for applications where heat must be dissipated quickly and efficiently. It is also highly reliable and can withstand temperatures up to 125°C for prolonged periods of time.
The ATS-16E-161-C3-R0 is an excellent choice for thermal management solutions. It is highly efficient and reliable, and it has a wide range of applications, making it a popular choice for many industries.
The specific data is subject to PDF, and the above content is for reference