| Allicdata Part #: | ATS27277-ND |
| Manufacturer Part#: |
ATS-16E-168-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-168-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.01°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is key when it comes to electronic applications. Heat is generated when power is applied to the circuit board components, and it is critical that this heat be dissipated from the circuit board in order to ensure reliable operation of the system. One of the best methods of accomplishing this is through the use of heat sinks, and more specifically, the ATS-16E-168-C2-R0 heat sink.
The ATS-16E-168-C2-R0 heat sink is made up of a highly efficient aluminum fin type design. The fins are arranged in a specific pattern to maximize surface-to-air contact and ensure maximum heat dissipation. Additionally, the heat sink features a unique internal construction which helps to reduce the amount of noise that is generated when the heat sink is in operation. This makes the ATS-16E-168-C2-R0 an ideal choice for applications where low noise levels are required.
The ATS-16E-168-C2-R0 heat sink is designed for a wide range of applications, including system chipset cooling, LED lighting cooling, power module cooling, and communications systems cooling. It is also suitable for use in medical, automotive, military, and aerospace applications. It features a robust construction, which allows it to be reliably used in even the most stringent and extreme temperature conditions.
The ATS-16E-168-C2-R0 heat sink is designed to operate using a natural air convection principle. In this type of design, the fins are exposed to the air, and are heated by the natural convection of air around them. As the air is heated, it rises, and is replaced by cooler air. The effect of this is to draw heat away from the fins and dissipate it into the atmosphere. This type of operation allows for low thermal resistance, quick heat dissipation, and improved cooling efficiency.
In addition to providing a reliable source of cooling for electronics, the ATS-16E-168-C2-R0 heat sink is also remarkably easy to install. It is designed with a simple clip-on attachment system that can be easily mounted onto a circuit board. After installation, the heat sink is secured in place and ready for use.
The ATS-16E-168-C2-R0 heat sink is the perfect solution for thermal management applications. With its reliable cooling performance, easy installation, and robust construction, it is the perfect choice for a wide range of applications. It is the ideal choice for reliably cooling electronic components in extreme conditions, whilst providing low noise operation.
The specific data is subject to PDF, and the above content is for reference