ATS-16E-35-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.230" (5.84mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	22.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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The ATS-16E-35-C1-R0 is a high-performance thermal heat sink designed for cooling medium and high-power electrical devices. It features excellent heat dissipation characteristics that provide efficient cooling of electrical components and devices. The ATS-16E-35-C1-R0 is a great choice for applications such as data center, server, telecommunication, and other power electronic applications.The ATS-16E-35-C1-R0 is a highly efficient, lightweight, and compact solution for thermal management of electrical components and devices. The device features a unique design with two main components; a sleeve and a plate. The sleeve is made from either aluminum or copper with fins on the inside and support fins on the outside. The plate is constructed from copper and serves as a heat sink to dissipate the heat generated by the device it is cooling.The ATS-16E-35-C1-R0 comes in three different versions; standard, advanced and extreme. The standard version is used for applications with low power and does not require any extra features. The advanced version is ideal for applications with medium power and includes features such as additional support fins and fins with increased fin density for better heat dissipation. The extreme version is designed for applications with high power and comes with features like increased surface area, an advanced fin design, and an additional support plate.The working principle of the ATS-16E-35-C1-R0 is simple: the device absorbs the heat generated by the electrical components and dissipates it into the surrounding air. The fins on the sleeve draw heat away from the device and absorb it on the inside. The fins then dissipate the heat into the surrounding air via convection, resulting in a decrease in the temperature of the device.The ATS-16E-35-C1-R0 is designed to provide reliable cooling of medium and high-power devices. The device is constructed with an efficient fin arrangement and a sturdy support base for enhanced heat dissipation. This makes the device suitable for applications that generate high amounts of heat. Additionally, its lightweight design ensures that the device is easy to install and use. The ATS-16E-35-C1-R0 is the perfect solution for applications that demand reliable thermal management. Its efficient heat dissipation characteristics make it an ideal choice for data center, server, and other power electronic applications. The device is a cost-effective and easy-to-install solution for dissipating heat away from electrical components and devices.

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