| Allicdata Part #: | ATS27366-ND |
| Manufacturer Part#: |
ATS-16E-75-C2-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16E-75-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.25080 |
| 10 +: | $ 3.16197 |
| 25 +: | $ 3.07667 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical factor for many electronic devices that run at high temperatures. One option for efficiently managing temperature is the use of a heat sink. ATS-16E-75-C2-R0 heat sinks are a type of passive cooling device designed to absorb and diffuse heat in an electronic system. Heat sinks are commonly used to protect sensitive components from thermal damage due to heat accumulation or overheating.
The ATS-16E-75-C2-R0 heat sinks are designed for applications in die attach, display, and driver modules. The design of the ATS-16E-75-C2-R0 heat sink features optimized fin and base design, plus high thermal conductivity. This makes it ideal for small form factor designs and provides an ideal heat sink cooling solution for multimedia applications, gaming systems, and automotive electronics. Furthermore, the ATS-16E-75-C2-R0 can be used with a wide range of contact configurations and does not require a soldered connection to the heat source.
The working principle of the ATS-16E-75-C2-R0 heat sink is based on the principles of thermal conductivity and convection. When heat is present, the base material of the heat sink will transfer it away from the connected device. The high thermal conductivity of the ATS-16E-75-C2-R0 will then draw the heat away from the source. At the same time, the fin design of the heat sink helps to dissipate the heat. As the heat is conducted away from the source, the fins create air circulation, which helps to reduce the temperature of the heat sink. This in turn helps to keep the connected device cool.
ATS-16E-75-C2-R0 heat sinks are designed to be used in open environment applications and feature a 4.0mm thickness profile. Furthermore, they are compatible with automatic soldering, allowing for easier installation. In addition, the design of the ATS-16E-75-C2-R0 features high corrosion resistance, allowing for a longer service life in harsh environmental conditions. With its ability to reliably dissipate the heat from an electronic system, ATS-16E-75-C2-R0 heat sinks are an ideal thermal management solution for a variety of different applications.
The specific data is subject to PDF, and the above content is for reference