| Allicdata Part #: | ATS-16F-108-C1-R1-ND |
| Manufacturer Part#: |
ATS-16F-108-C1-R1 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-108-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions play a vital role in the proper functioning of a range of electronics, from computers to medical devices to consumer products. Heat buildup inside powered equipment can quickly cause malfunction, damage, or even catastrophic failure, making it imperative for any application to feature adequate cooling solutions. The ATS-16F-108-C1-R1 heat sink is designed to provide superior thermal conductivity, especially in air-cooled applications, in order to ensure the longevity and stability of electronics.
Application Field:
The ATS-16F-108-C1-R1 heat sink is ideal for applications which require advanced thermal management solutions in a compact form factor. It is suited for a wide range of electronics, including computers, medical devices, consumer products, and more. It is particularly well-suited for air-cooled applications, as its fin design and natural aluminum construction facilitate the efficient transmission of heat. Its unique design also allows it to fit into a variety of unique installation scenarios, making it a versatile and practical solution.
Working Principle:
The ATS-16F-108-C1-R1 heat sink works by utilizing natural aluminum and its unique fin design to facilitate the efficient transmission of heat. The fins are precisely spaced apart to maximize the surface area exposed to any incoming airflow. This allows the heat sink to absorb and dissipate the vast majority of any incoming thermal energy. By increasing the rate at which the heat sink absorbs heat, the unit can actively reject more thermal energy from the underlying electronics, preventing component damage or failure due to overheating.
The ATS-16F-108-C1-R1 heat sink is also designed with enhanced contact layer mounting provisions. Its mounting mechanism ensures even contact between the heat sink’s base plate and the underlying electronic components. This helps to to ensure maximum conductivity from the heat sink to the underlying components. The protection layer also prevents any corrosion of the base plate, extending the lifespan of the heat sink.
Additionally, the ATS-16F-108-C1-R1 heat sink is both lightweight and durable. It is designed to withstand the daily use and abuse that is commonly seen in applications such as computers, medical devices, and consumer products. Its natural aluminum construction also ensures temperature stability, allowing for higher levels of thermal conductivity with fewer malfunctions or potential failure points.
The ATS-16F-108-C1-R1 heat sink is a reliable and efficient cooling solution for a variety of electronics. Its blend of superior thermal conductivity, enhanced contact layer mounting and corrosion protection, and lightweight durability make it a superior choice for a variety of air-cooled applications.
The specific data is subject to PDF, and the above content is for reference