ATS-16F-117-C3-R0

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The ATS-16F-117-C3-R0 is an efficient and reliable thermal-heat sink that plays an important role in dissipating heat from a wide variety of electronic applications. Such applications include high power LEDs, diodes, transistors and circuits used in automotive, industrial, military, and other industries. The thermal-heat sink works by drawing heat away from the system into a cold sink. The heat is then distributed, rejecting the heat to the outside environment. The thermal-heat sink is an integral part of the system, enabling it to operate more efficiently than conventional methods of cooling.

The ATS-16F-117-C3-R0 thermal-heat sink is composed of a combination of aluminum fins and copper heat pipes called a “heat core”. The aluminum fins act as a heat spreader, allowing the heat to be spread out over a larger area. This helps to maintain cooler temperature throughout the system. The copper heat pipes act as a heat transfer channel to efficiently move the heat away from the system and reject the heat to the external environment. This helps to keep the system as cool as possible.

The thermal-heat sink consists of a finned base plate with a tab that is soldered to the board, usually at an optimal distance of 2mm from the surface of the board. The soldered tab serves as the main connection point between the board and the heat sink and features multiple studs that are used to attach the fins. Additionally, a mounting bracket is included for mounting the thermal-heat sink to the board.

The ATS-16F-117-C3-R0 thermal-heat sink features a specially designed fin array with optimized shapes that improve the overall performance of the system by providing better heat dissipation. The thermal-heat sink also features a unique pin fin design, which increases the surface area to disperse heat away from the system. The fins are engineered to provide maximum efficiency and provide superior cooling performance at relatively low airflow rates.

The ATS-16F-117-C3-R0 thermal-heat sink offers a wide range of features and benefits, including improved system performance and energy efficiency. Additionally, the thermal-heat sink is designed to be compatible with most standard fan designs, allowing the user to easily integrate the thermal-heat sink into their system. Furthermore, the thermal-heat sink is also designed with an innovative thermal diffuser, which ensures optimal thermal transfer across the board.

Overall, the ATS-16F-117-C3-R0 thermal-heat sink is a great option for dissipating heat away from electronic components. It is a reliable, efficient, and affordable solution that provides superior performance at a fraction of the cost of traditional cooling methods. The thermal-heat sink is designed for a wide range of applications and is constructed from quality materials, ensuring durability and long-term performance. Furthermore, the thermal-heat sink is easy to install and requires minimal maintenance or upkeep, making it a great option for any application.

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