| Allicdata Part #: | ATS-16F-128-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-128-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-128-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal or Heat Sinks are specialized devices used to transfer heat away from hot components and other objects. The ATS-16F-128-C3-R0 is one type of thermal heat sink that serves to absorb and distribute heat from these components to create a more stable temperature profile. It also serves to protect working electronics from damage over time caused by excess heat.
The key components of the ATS-16F-128-C3-R0 are the finned base and the fins. The base, which is often a metal like aluminum or copper, serves as the core of the heat sink. It attaches to the device whose heat flow needs to be managed and absorbs the heat generated during operation. The fins act as a mechanism for heat to escape; friction provides resistance to the hot air flow, which causes the fins to expand and draw cooler air in from the ground.
The ATS-16F-128-C3-R0 is primarily used in high-end electronics where high-powered components may be at risk of overheating. Its design involves an inclined surface that allows maximum surface area per unit volume. This increases the rate of heat absorption and dissipation, and also maximizes air circulation for improved cooling. In addition, the design of the fins minimizes friction between the fin and air to reduce noise and vibration.
The ATS-16F-128-C3-R0 is an excellent choice for controlling heat in electronics. Its larger size and surface area allows it to absorb more heat, so it is well suited for high-power components that generate a large amount of heat. The fin design also maximizes air circulation for maximum cooling efficiency, reducing temperatures and power consumption. Additionally, the fins also minimize noise and vibration, making the ATS-16F-128-C3-R0 perfect for a quieter computing environment.
In summary, the ATS-16F-128-C3-R0 is an effective and efficient thermal heat sink. The inclined fin design increases surface area, allowing for more heat absorption, and the fins provide greater air circulation for maximum cooling efficiency. The fins also reduce noise and vibration, making the ATS-16F-128-C3-R0 an ideal choice for reducing heat in high-end electronics without disrupting the environment.
The specific data is subject to PDF, and the above content is for reference