| Allicdata Part #: | ATS-16F-142-C1-R0-ND |
| Manufacturer Part#: |
ATS-16F-142-C1-R0 |
| Price: | $ 3.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-142-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.04353 |
| 30 +: | $ 2.96100 |
| 50 +: | $ 2.79657 |
| 100 +: | $ 2.63208 |
| 250 +: | $ 2.46758 |
| 500 +: | $ 2.38533 |
| 1000 +: | $ 2.13857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-16F-142-C1-R0 is a heavy-duty thermal-heat sink designed to dissipate heat generated by high-power electronic components. By efficiently removing heat from those components, ATS-16F-142-C1-R0 effectively extends their life and prevents them from being affected by overheating.
The ATS-16F-142-C1-R0 consists of a metal heatsink body composed of a type of aluminum alloy, featuring a black oxide coating for corrosion resistance. The heatsink is designed with a low profile to fit into tight spaces and with extended &textgr; fins to increase surface area for better heat dissipation. A series of strategically-oriented holes incorporated into the design allow for greater heat convection and increase the circulation of air around the heatsink.
The working principle of the ATS-16F-142-C1-R0 is rather straightforward. Heat generated by the electronic components is transmitted to the heatsink by conduction. Once heat is transferred to the heatsink\'s surface, it is then dissipated into the air surrounding the heatsink. This process is aided by the internal structure of the heatsink which increases the surface area. As air is drawn into the heatsink and passes over the fins, its temperature is lowered, transferring thermal energy into the air. This heat is then dissipated, allowing the heatsink to effectively cool the source component.
The ATS-16F-142-C1-R0 is an effective solution to dissipate heat. As a heavy-duty thermal-heat sink, it offers high performance for high power applications. It is an ideal choice for applications where there is limited space for installation and where extended life and improved reliability is a priority.