ATS-16F-15-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16F-15-C3-R0-ND

Manufacturer Part#:

ATS-16F-15-C3-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16F-15-C3-R0 datasheetATS-16F-15-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.89781
30 +: $ 3.68151
50 +: $ 3.46487
100 +: $ 3.24834
250 +: $ 3.03178
500 +: $ 2.81523
1000 +: $ 2.76109
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

The ATS-16F-15-C3-R0 is a thermal heat sink designed for cooling applications to ensure proper and reliable operation of electronic components. It is designed to handle a wide range of heating elements such as high power LEDs, rectifiers, transistors, integrated circuits, etc. It has an extruded aluminum heatsink, thermally conductive silicone interface material, and a dual-side cooling fan for efficient cooling performance. In this paper, we will discuss the application field and working principle of the ATS-16F-15-C3-R0.

Application Field

The ATS-16F-15-C3-R0 thermal heat sink is primarily used in applications where efficient cooling of electronic components is necessary. Some common applications where the heat sink is used include:
  • High power LED lighting systems
  • Rectifiers
  • Transistors
  • Integrated circuits
Other applications include microprocessor-based systems, power supplies, solenoids, electromagnets, and other components that require large amounts of power.

Working Principle

The ATS-16F-15-C3-R0 thermal heat sink works on the principle of convection-powered heat transfer. It uses a combination of an extruded aluminum heat sink, a thermally conductive silicone interface material, and a dual-side cooling fan for efficient cooling performance. The extruded aluminum heat sink is designed to absorb and dissipate heat from the electronic components it is designed to cool. The thermally conductive silicone interface material helps to conduct the heat quickly and evenly to the heat sink. The dual-side cooling fan draws in air from outside the system and forces it over the heat sink, which helps to cool the electronics.

Conclusion

In conclusion, the ATS-16F-15-C3-R0 thermal heat sink is a highly efficient cooling solution designed to handle high levels of power. It makes use of an extruded aluminum heat sink, a thermally conductive silicone interface material, and a dual-side cooling fan for efficient cooling performance. It is primarily used in applications involving high power LEDs, rectifiers, transistors, integrated circuits, microprocessor-based systems, power supplies, solenoids, and electromagnets.

The specific data is subject to PDF, and the above content is for reference

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