
Allicdata Part #: | ATS-16F-15-C3-R0-ND |
Manufacturer Part#: |
ATS-16F-15-C3-R0 |
Price: | $ 4.33 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 50X50X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.89781 |
30 +: | $ 3.68151 |
50 +: | $ 3.46487 |
100 +: | $ 3.24834 |
250 +: | $ 3.03178 |
500 +: | $ 2.81523 |
1000 +: | $ 2.76109 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
The ATS-16F-15-C3-R0 is a thermal heat sink designed for cooling applications to ensure proper and reliable operation of electronic components. It is designed to handle a wide range of heating elements such as high power LEDs, rectifiers, transistors, integrated circuits, etc. It has an extruded aluminum heatsink, thermally conductive silicone interface material, and a dual-side cooling fan for efficient cooling performance. In this paper, we will discuss the application field and working principle of the ATS-16F-15-C3-R0.Application Field
The ATS-16F-15-C3-R0 thermal heat sink is primarily used in applications where efficient cooling of electronic components is necessary. Some common applications where the heat sink is used include:- High power LED lighting systems
- Rectifiers
- Transistors
- Integrated circuits
Working Principle
The ATS-16F-15-C3-R0 thermal heat sink works on the principle of convection-powered heat transfer. It uses a combination of an extruded aluminum heat sink, a thermally conductive silicone interface material, and a dual-side cooling fan for efficient cooling performance. The extruded aluminum heat sink is designed to absorb and dissipate heat from the electronic components it is designed to cool. The thermally conductive silicone interface material helps to conduct the heat quickly and evenly to the heat sink. The dual-side cooling fan draws in air from outside the system and forces it over the heat sink, which helps to cool the electronics.Conclusion
In conclusion, the ATS-16F-15-C3-R0 thermal heat sink is a highly efficient cooling solution designed to handle high levels of power. It makes use of an extruded aluminum heat sink, a thermally conductive silicone interface material, and a dual-side cooling fan for efficient cooling performance. It is primarily used in applications involving high power LEDs, rectifiers, transistors, integrated circuits, microprocessor-based systems, power supplies, solenoids, and electromagnets.The specific data is subject to PDF, and the above content is for reference
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