| Allicdata Part #: | ATS-16F-157-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-157-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-157-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical to the performance and reliability of electronic systems. One of the most common solutions to heat problems is the use of heat sinks. Heat sinks are designed to transfer heat away from components and thereby protect them from being damaged. For air cooled solutions, ATS offers a range of heat sinks designed to meet different needs. The ATS-16F-157-C3-R0 is a heat sink that has found application in numerous industrial applications.
The ATS-16F-157-C3-R0 is a single-piece extruded heat sink made from anodized aluminum. The heat sink features a fin array that is optimized to provide an effective heat transfer solution with minimal noise. The ATS-16F-157-C3-R0 has a design airflow of 32.9 CFM, which provides ample air flow while also offering quiet operation. The heat sink has a natural anodized finish, which gives it a professional and attractive appearance. A range of mounting accessories are available for securing the heat sink to the desired application.
The ATS-16F-157-C3-R0 has a thermal resistance of 0.037 K/W, which makes it suitable for applications that require thermal efficiency. The heat sink offers excellent heat dissipation for components with up to 200W of total thermal power. In applications where higher temperature parts are used, the ATS-16F-157-C3-R0 can be used with active cooling solutions to provide increased thermal capacity.
The working principle of the ATS-16F-157-C3-R0 heat sink is based on thermodynamics. The heat sink works by creating a large surface area that dissipates heat away from components. The fin array on the heat sink increases the surface area to provide greater heat dissipation. The fin array has a high thermal conductivity, which allows heat to be quickly transferred away from the source to a cooler environment. The heat sink also has a low profile design which allows it to fit into tight spaces where other solutions may not be feasible.
The ATS-16F-157-C3-R0 has found application in a range of industrial applications. It is commonly used in power electronics including power supplies, inverters and UPS systems. It can also be used in HVAC and other industrial control systems, automotive, medical and military applications. The high thermal performance and efficient noise elimination of the ATS-16F-157-C3-R0 make it an ideal choice for many applications where thermal management is essential.
In conclusion, the ATS-16F-157-C3-R0 is a versatile heat sink that finds application in many industries. The heat sink offers excellent heat dissipation and has a low profile design, making it a suitable choice for applications where space is limited. The heat sink also has a thermal resistance of 0.037 K/W, which makes it an excellent choice for applications that require thermal efficiency. The heat sink is easy to mount and offers good noise elimination due to its optimized fin array. Therefore, the ATS-16F-157-C3-R0 is an ideal solution for thermal management in a variety of applications.
The specific data is subject to PDF, and the above content is for reference