| Allicdata Part #: | ATS27468-ND |
| Manufacturer Part#: |
ATS-16F-161-C2-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-161-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.25880 |
| 10 +: | $ 4.14099 |
| 25 +: | $ 3.91079 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.74°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential part of any modern electrical system, especially for electronic devices which generate heat such as computers and industrial control systems. Heat sinks are used to transfer and dissipate heat in order to maintain desired temperatures and protect components from damage. The ATS-16F-161-C2-R0 is an example of a heat sink designed to function in severe conditions, featuring a rugged stainless steel construction and corrosion resistant aluminum oxide coating.
The ATS-16F-161-C2-R0 is a flat-pack heat sink range designed expressly for heavy thermal loads. It is optimized for use in confined space applications where cooling air flow is restricted. The product\'s specifically optimized pin-fins allow the heat sink to achieve high thermal performance even with low air velocity. Its curved Aluminum Alloy contours reduce the air vortex formation and turbulence level, resulting in higher efficiency.
At its core, the ATS-16F-161-C2-R0 features copper alloy base and fins, designed for both high conductivity and corrosion resistance. It also includes a rigid extrusion process that allows the heat sink to maintain its shape when subjected to excessive temperatures and changing loads. The fins themselves feature a series of channels and indentations that allow air to pass the heat sink more efficiently, thus improving its performance even further.
The ATS-16F-161-C2-R0 is designed to dissipate heat from power semiconductor devices such as high-power transistors, IGBTs, thyristors and other integrated circuits. It is also suitable for use in harsh environments, as its robust stainless steel construction and corrosion-resistant aluminum oxide coating provide increased protection from rust. Its thermal performance has been optimized for a wide range of temperatures, with an acceptable range that extends from -40°C to +105°C.
The ATS-16F-161-C2-R0 includes mounting accessories for fast and secure mounting, allowing users to quickly install and replace the unit. It is ideal for a variety of mounting configurations, including holes, pem studs or rivets. In addition, the product includes an adjustable thermal link which allows users to monitor and adjust the temperature of the heat sink remotely for efficient thermal management.
In conclusion, the ATS-16F-161-C2-R0 is a rugged and reliable heat sink designed for severe environmental conditions and heavy thermal loads. Its copper alloy base and fins provide high conductivity and corrosion resistance, while its extrusion process ensures the unit\'s shape is maintained when subjected to temperature changes. Its mounting accessories allow for easy installation and replacement, and its adjustable thermal link facilitates remote temperature monitoring and adjustment. For these reasons, the ATS-16F-161-C2-R0 is an ideal choice for applications requiring heat transfer and management.
The specific data is subject to PDF, and the above content is for reference