| Allicdata Part #: | ATS-16F-168-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-168-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-168-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are one of the most common methods used to transfer heat away from electronic components. The ATS-16F-168-C3-R0, manufactured by Associated Technical Services, is a heat sink that has been designed specifically for the transfer of heat in harsh and hostile environments. In this article, we will explain the application field and working principle of the ATS-16F-168-C3-R0.
The ATS-16F-168-C3-R0 has been designed to be used in a variety of applications. It can be used for a range of industrial and commercial applications, including the protection of electronics from the damaging effects of overheating. It is also suitable for the cooling of critical components such as CPUs, GPUs, and memory components in computing devices.
The ATS-16F-168-C3-R0 features high-quality construction, using an aluminum core and a wide variety of fins, as well as an aluminum backplate. Its design ensures maximum heat transfer efficiency, with its thick fins providing increased surface area for the transfer of thermal energy. The aluminum backplate helps to ensure that the heat sinks do not bend or flex under normal operating conditions.
The ATS-16F-168-C3-R0 is designed for use in environments that experience temperature fluctuations. The heat sink has been designed to dissipate heat quickly and evenly, ensuring that thermal conditions remain stable and consistent. The aluminum backplate also adds to its stability, providing the rigid support needed for the fins and the aluminum core.
The ATS-16F-168-C3-R0 can be mounted onto the back of a computer enclosure or the underside of a motherboard. It has been designed to provide efficient heat transfer from the computer\'s components to the heat sink. This helps to ensure that the system remains cool and functional even under high load conditions.
The ATS-16F-168-C3-R0 is a highly efficient and reliable thermal - heat sink. Its design ensures maximum heat transfer efficiency, and its construction ensures stability even in fluctuating temperatures. It is perfect for a range of industrial and commercial applications, including the protection of critical components from the damaging effects of overheating.
The specific data is subject to PDF, and the above content is for reference