ATS-16F-170-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16F-170-C3-R0-ND

Manufacturer Part#:

ATS-16F-170-C3-R0

Price: $ 3.66
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16F-170-C3-R0 datasheetATS-16F-170-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.32892
30 +: $ 3.23862
50 +: $ 3.05878
100 +: $ 2.87885
250 +: $ 2.69892
500 +: $ 2.60896
1000 +: $ 2.33906
Stock 1000Can Ship Immediately
$ 3.66
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.26°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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The ATS-16F-170-C3-R0 thermal-heat sinks are an effective and efficient workhorse when it comes to tackling the challenges posed by thermal management – and it really shows when everything is functioning as it should. Not only do these products provide an improved distribution of heat in all types of electronics, they also ensure maximum safety and reliability in terms of preventing overheating.

In terms of design, the ATS-16F-170-C3-R0 thermal-heat sink is a highly advanced model that features a solid aluminum alloy fin stack. The body is constructed of anodized aluminum using a die-casting process and it provides a much more efficient heat control than passive cooling. The two heat pipes are embedded in the aluminum fins and they are responsible for dissipating heat away from the device. On top of that, these devices feature a low-noise fan that helps with heat dissipation even more, providing greater reliability and performance.

The main working principle of these thermal-heat sinks is based on the concept of thermal inertia and insulation. With the solid aluminum alloy fin stack, the device is able to better retain heat generated by the device, allowing it to keep running at a cooler temperature than other models. This, in turn, extends the life of the device as it is able to avoid overheating. Additionally, the two heatpipes embedded in the aluminum fins help transfer heat away from the device while also providing the necessary insulation, resulting in less heat generation and more efficient heat dissipation.

In terms of application field, the ATS-16F-170-C3-R0 thermal-heat sinks are perfect for those looking for a reliable and efficient cooling solution. These products are commonly used in electronic devices such as computers, laptops, servers, and routers, as well as in telecom and medical equipment. The low-noise fan ensures that these devices won’t disturb the environment when running, making a great choice for those looking for a quieter, more efficient cooling solution.

The ATS-16F-170-C3-R0 thermal-heat sinks are an excellent choice for those looking for a more efficient and reliable cooling solution for their electronic devices. With its advanced design, low-noise fan, and two embedded heatpipes, these devices are sure to provide excellent thermal management and protection against overheating. They are also perfect for those looking for a quieter device, as the fan ensures that these devices won’t disturb the environment when running. On top of that, the ATS-16F-170-C3-R0 thermal-heat sinks are also great for use in applications such as computers, laptops, servers, routers, telecom, and medical equipment.

The specific data is subject to PDF, and the above content is for reference

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