| Allicdata Part #: | ATS-16F-171-C1-R0-ND |
| Manufacturer Part#: |
ATS-16F-171-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-171-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are devices that allow enhanced cooling function of a system using a combination of air and other thermal materials. The ATS-16F-171-C1-R0 is designed to provide this same functionality but instead of relying on air, this particular model uses an internal fan, copper fins, and aluminum material to emit excessive heat that would typically cause degradation of electronics.
The ATS-16F-171-C1-R0 is a multi-function heat sink with excellent thermal performance and cost savings. It is suitable for use in commercial, industrial, and military applications where space and energy efficiency is of upmost importance. Embedded systems with high-power parts, components and assemblies can benefit from the increased efficiency provided by using the ATS-16F-171-C1-R0.
The ATS-16F-171-C1-R0 thermal heat sink consists of a metal housing, copper fins, an internal fan, and an aluminum base. The copper fins act as a heat-spreaders, transferring heat from the active area of the device to the active surface area of the fins. The aluminum base acts as a heat-distributor, allowing the absorbed heat to be moved throughout the fins and radiated away from the device. The internal fan then directs air through the unit to increase heat transfer.
When installed, the ATS-16F-171-C1-R0 thermal heat sink increases the cooling capacity of the device while reducing the overall system power consumption. This ensures that the device remains at the optimal operating temperature and reliable functioning. The fan also has a low noise operation to make it ideal for use in residential and commercial settings.
The working principle of the ATS-16F-171-C1-R0 is very simple. Heat is transferred from the active area of the device to the copper fins via conduction. The aluminum base then distributes the heat across the aluminum fins. The fan then pulls air through the unit and dissipates it, completing the thermal cycle.
The ATS-16F-171-C1-R0 is an excellent solution for high-power applications where thermal management is essential for system reliability and performance. It is suitable for use in commercial, industrial and military applications. It is also useful for residential and commercial settings due to its low-noise operation. This thermal heat sink provides an efficient and cost-effective way to reduce the thermal profile of devices.
The specific data is subject to PDF, and the above content is for reference