| Allicdata Part #: | ATS-16F-18-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-18-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-18-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heatsinks are commonplace in a variety of applications, both for cooling devices and for controlling the rate at which heat is dissipated from them. The ATS-16F-18-C3-R0 is a heatsink designed to provide efficient heat dispersal, and this article will discuss both its application field and its working principles.
The ATS-16F-18-C3-R0 can be used in a wide range of cooling applications, including automotive, telecommunications, industrial and medical. It has a unique combination of thermal performance features, such as thermal conductivity, low thermal resistance, high temperature capacity, and good thermal stability. It also features a natural convection cooling mode, which is highly efficient and ensures maximum heat dispersion in a given environment. The heat sink can also be designed for use in direct contact applications, such as directly cooling heat-producing components.
The working principle of the ATS-16F-18-C3-R0 is based on the thermal transfer of heat from one object to another. The heat sink utilizes the convective mode to dissipate heat from the device to the surrounding environment. The large surface area of the fins is what maximizes the thermal radiation and thermal conduction. This helps to ensure that heat is dispersed away from the device and to the environment quickly and efficiently to reduce the risk of overheating.
The ATS-16F-18-C3-R0 is designed to be light weight and compact, making it ideal for applications in confined spaces, such as within computer systems, and even in applications where space is limited. The heatsink is also highly efficient and cost-effective, making it a viable solution to the problem of overheating. It is also designed to be easy to install and maintain.
The ATS-16F-18-C3-R0 has been tested by numerous professionals in the electricity and telecommunications industries, and it has proven itself to be an effective thermal management tool. It is capable of efficiently dissipating heat from components and providing a reliable cooling solution. It is also easy to install and maintain, making it an ideal choice for a variety of cooling applications.
The specific data is subject to PDF, and the above content is for reference