
Allicdata Part #: | ATS27502-ND |
Manufacturer Part#: |
ATS-16F-192-C2-R0 |
Price: | $ 5.03 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X35MM R-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 4.56750 |
10 +: | $ 4.44150 |
25 +: | $ 4.19479 |
50 +: | $ 3.94808 |
100 +: | $ 3.70138 |
250 +: | $ 3.45462 |
500 +: | $ 3.20786 |
1000 +: | $ 3.14617 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.378" (35.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.35°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management of electronics is critical for performance and reliability. Heat is created by all electronic components, so the purpose of heat sinks is to transfer this heat away from the device and into the environment. The ATS-16F-192-C2-R0 heat sink is designed to effectively store and dissipate heat from circuit boards and equipment housings, protecting sensitive components and reducing the risk of debris build up and component damage.
Heat sinks are designed to increase surface area and maximize air flow in order to facilitate the dissipation of heat. ATS-16F-192-C2-R0 heat sinks have a laser-engraved aluminum fins with a fin pitch and footprint of 0.5mm and 5.5mm respectively. They are designed with a wide variety of designs, from flat, to honeycomb, and even custom designs, aiming to promote rapid thermal transfer. By creating a significant surface for air flow, heat sinks provide better cooling packages for a variety of electronics.
To help maintain maximum performance, ATS-16F-192-C2-R0 thermal management systems also feature thermally conductive inks and adhesives. These specialized inks and adhesives conduct heat away from sensitive components or boards. To match the specific needs of different applications, these adhesives and inks range from soft silicone to nano-filled silver. By using these tools, manufacturers can develop a highly efficient cooling solution tailored to their unique needs.
One of the biggest advantages of ATS-16F-192-C2-R0 heat sinks is that they are lightweight and easy to install. This design feature allows them to be used in a variety of applications including printed circuit boards (PCBs), automotive electronics, telecommunications, and consumer electronics. In addition, they are also RoHS (Restriction of Hazardous Substances) compliant. This allows manufacturers to remain compliant with relevant industry requirements.
Overall, ATS-16F-192-C2-R0 heat sinks offer one of the most innovative and effective solutions for thermal management of electronics. Their efficient design combined with special inks and adhesives provides a wide range of applications. In addition, their lightweight and easy installation make them suitable for a variety of consumer electronics, automotive electronics, and other electronics.
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