| Allicdata Part #: | ATS27510-ND |
| Manufacturer Part#: |
ATS-16F-20-C2-R0 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-20-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.52970 |
| 10 +: | $ 4.40685 |
| 25 +: | $ 4.16203 |
| 50 +: | $ 3.91734 |
| 100 +: | $ 3.67246 |
| 250 +: | $ 3.42763 |
| 500 +: | $ 3.18280 |
| 1000 +: | $ 3.12159 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential factor in many electronic systems, especially in applications where high power and heat dissipation are involved. Heat sinks are one type of thermal management solution that will increase the thermal performance of an electronic system. Heat sinks are passive devices that work by absorbing heat generated by an electronic component and transferring it away from the component into the surrounding environment. One type of heat sink is the ATS-16F-20-C2-R0.
The ATS-16F-20-C2-R0 is a high-performance thermal management solutions designed for a variety of applications. This heat sink is made of aluminum with a solid copper base. It is pre-drilled with 8 holes along the base for easy installation and can accommodate up to 16 fan. It can dissipate up to 200W of heat and reduce board temperature by up to 12°C with proper cooling. This heat sink is designed for applications such as LED lighting, flat panel displays, power supplies, electric heating systems, industrial electronics, and automotive electronics.
The ATS-16F-20-C2-R0 heat sink has a unique design which allows it to effectively dissipate heat away from the component it is attached to. It uses a copper base plate which provides good thermal conductivity and dissipates heat into the aluminum fins. The aluminum fins are also designed with a unique shape that increases the surface area of the heat sink, allowing for a greater amount of heat to be dissipated. In addition, this heat sink is equipped with thermal pads which can be used to transfer heat between the heat sink and the component, or to provide extra insulation where needed.
The working principle of the ATS-16F-20-C2-R0 heat sink is simple and easy to understand. Heat is generated by the component and is absorbed by the aluminum fins. The aluminum fins conduct and dissipate the heat into the surrounding air. The copper base provides good thermal conductivity between the component and the aluminum fins, ensuring that the maximum amount of heat is dissipated away from the component. The thermal pad can be used to help absorb additional heat and transfer it away from the component, or to provide extra insulation where needed.
The ATS-16F-20-C2-R0 heat sink is a great addition to any thermal management solution. Its high efficiency and unique design make it an ideal choice for applications requiring high thermal performance. Its pre-drilled holes allow for easy installation and the thermal pad can be used for added insulation or to transfer additional heat away from the component. With its excellent performance and proven reliability, the ATS-16F-20-C2-R0 is an excellent choice for any application where effective heat dissipation is needed.
The specific data is subject to PDF, and the above content is for reference