| Allicdata Part #: | ATS-16F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks, by definition, are devices that transfer heat away from an object. Heat sinks are essential components in any electronic equipment, as they help dissipate heat away from the device to ensure that it can perform at its best. The ATS-16F-20-C3-R0 is one such example of a heat sink designed to aid in the cooling process of electronics. In this article, we will explore its application fields & working principles.
Working Principle
The ATS-16F-20-C3-R0 consists of two parts: a base plate and a set of fins. The base plate is made of aluminum and has a highly efficient heat transfer rate compared to other metals, while the fins are made of aluminum and allow for better airflow throughout the device. To maximize the cooling efficiency, the base plate is designed with a series of grooves so that when heat is transferred across the device, air is passed through the grooves and over the fins, creating a convection current. This allows the heat to be successfully dissipated from the electronic device.
Applications
One of the primary applications of the ATS-16F-20-C3-R0 is electronic systems that generate high levels of heat. Examples are computers, servers, and other electronic components like microprocessors, GPUs, and power amplifiers. Due to the high heat output of these components, the cooling capacity of the ATS-16F-20-C3-R0 is essential to ensure proper performance. Additionally, the design of the ATS-16F-20-C3-R0 is also beneficial for applications that need to be cooled from multiple sides, such as telecommunications and automotive applications where multiple components need to be simultaneously cooled for optimal performance.
The ATS-16F-20-C3-R0 is also an ideal choice for applications running in high-vibration or shock environments due to its robust construction and superior impact resistance. The robust construction of the ATS-16F-20-C3-R0 ensures that it is capable of withstanding the added stress caused by vibration or shock, while its superior impact resistance allows it to absorb vibrations better than other heat sinks, thus leading to a longer lifespan.
Conclusion
In conclusion, the ATS-16F-20-C3-R0 is a highly efficient heat sink designed to dissipate heat away from electronics in order to optimize their performance. Its robust construction, superior impact resistance, and efficient heat transfer rate make it a great choice for applications that generate high levels of heat, as well as those operating in high-vibration or shock environments.
The specific data is subject to PDF, and the above content is for reference