| Allicdata Part #: | ATS-16F-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-16F-200-C3-R0 is a thermal heat sink widely used for cooling applications in various industries. As the name implies, the heat sink uses thermal energy to absorb heat from its environment and dissipate it into the atmosphere. The heat sink consists of a base plate on which the fins and other components are mounted. The fins are made of extruded aluminum or copper, which helps to enhance the heat transfer rate. The heat transfer occurs when air passes over the fins. The fins are designed to allow maximum air flow while absorbing and dissipating heat.
The ATS-16F-200-C3-R0 heat sink is commonly used in applications such as HVAC systems, refrigerators, computers, servers, and other electronics that generate heat. It is capable of cooling objects with temperatures as high as 1000 degrees Fahrenheit. Heat transfer rates are further increased when the heat sink is paired with a fan.
The heat sink is also ideal for applications involving liquid cooling systems, as it can be mounted directly to the system. This allows the liquid to flow through the fins smoothly, creating an efficient cooling system. The ATS-16F-200-C3-R0 heat sink is a cost-effective solution for applications where cooling is required, as it is relatively inexpensive and requires minimal maintenance.
When selecting the right ATS-16F-200-C3-R0 heat sink for an application, it is important to consider the size of the object that needs to be cooled, as well as the ambient temperature. Higher ambient temperatures require more efficient heat sinks, so it is important to select a model that can handle the heat load. Additionally, heat sinks with larger surface areas will increase the heat transfer rate, but may not be necessary in all applications. It is also important to consider the space available for installation, as the heat sink may need to be located away from the object it is cooling to prevent an excessive build-up of heat.
The ATS-16F-200-C3-R0 thermal heat sink provides an efficient and cost-effective cooling solution for applications where heat transfer is necessary. It is designed to absorb and dissipate heat from its environment and provide cooling for objects with temperatures up to 1000 degrees Fahrenheit. Its low cost and minimal maintenance requirements make it an ideal choice for a wide range of applications. Additionally, it is capable of being paired with fans and liquid cooling systems to further increase its efficiency.
The specific data is subject to PDF, and the above content is for reference