ATS-16F-210-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.24°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-16F-210-C3-R0

The ATS-16F-210-C3-R0 is a thermal - heat sink designed with a high quality aluminum composition. It is a low profile, low cost, low power solution in the thermal management market, and has been specifically designed to be an optimal choice for incorporating into PC systems. The thermal resistance offered by this product is remarkable, and thus makes this thermal - heat sink an ideal choice for products that require excellent heat dissipation performance and low noise operation.

Application Field and Working Principle

The ATS-16F-210-C3-R0 thermal - heat sink is applicable to many different applications. It is especially popular for use in consumer electronics, including PCs, laptops, and tablets as well as displays and set top boxes. This thermal – heat sink can also be used in industrial settings where heat dissipation is required, such as in medical and motorcycle parts. Additionally, this product can be used to replace traditional fan-based cooling systems in many applications such as game consoles, personal computers, and audio equipment.The working principle behind the ATS-16F-210-C3-R0 is a simple one. It utilizes a combination of convection and conduction to dissipate the heat from the component. It uses a solid base plate that is attached to a metal frame, creating a large surface area. This surface area is then populated with countless aluminum fins, which will effectively increase the heat dissipation area even further. This large surface area, combined with the rapid heat transfer from the fin to the air, offers unmatched thermal performance, allowing components to remain cooler than ever before. The aluminum fins of this particular thermal - heat sink are also coated with a black anodized surface to help reduce radiation when placed in an enclosed chassis. This coating helps to provide even more thermal performance, which is very beneficial for parts such as microprocessors and GPUs. This thermal - heat sink is also engineered to operate quietly, making it perfect for use in a variety of settings.

Compatibility and Installation

The ATS-16F-210-C3-R0 thermal - heat sink is compatible with all major motherboards, cases, and components such as processors, GPUs, and RAM. It can be installed in the same manner as any traditional heat sink with only a few adjustments – that is, using thermal paste for optimal performance. To begin, it is important to carefully clean the CPU’s surface and the back of the heat sink to ensure that there is no dirt or debris present that would affect the thermal performance of the product. Next, the user would apply a thin layer of thermal paste directly onto the center of the processor. They would then line up the mounting holes on the base of the heat sink to the corresponding holes on the motherboard, and attach the mounting screws provided. The user can then install the cooling fan, if necessary, and plug it in to the power supply.

Conclusion

In conclusion, the ATS-16F-210-C3-R0 is a highly effective thermal – heat sink perfect for use in consumer electronics, industrial settings, and for replacing traditional fan-based cooling systems. Through its combination of convection and conduction, as well as its impressive heat dissipation performance and quiet operation, the ATS-16F-210-C3-R0 can help keep components cool and running smoothly. It is also easy to install and compatible with all major motherboards, cases, and components.

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