| Allicdata Part #: | ATS-16F-22-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-22-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-22-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Application Field
The ATS-16F-22-C3-R0 thermal-heat sink is a popular cooling solution that is often used in a variety of industries, from electronics to automotive. Thermal-heat sinks are particularly useful in applications such as TVs, computers, and many types of small electronic equipment, where effective heat dissipation is needed. This thermal-heat sink is best suited for either dry or demanding wet environments where it needs to dissipate up to five watts of heat. It can be used in environments ranging from -20°C up to +50°C.
The ATS-16F-22-C3-R0 thermal-heat sink is designed with an aluminum surface and an aluminum extrusion frame with an anodized finish. It is designed with a bar-like shape and is easily installed with a few screws. It features a low-profile design and a large cooling surface to help dissipate heat quickly and efficiently. There is also an integrated thermal binding material included to increase the thermal conductivity of the thermal-heat sink.
The ATS-16F-22-C3-R0 thermal-heat sink is ideal for applications such as LED lighting, power supplies, computers, small industrial equipment, and more. It is suitable for a wide range of thermal management needs.
Working Principle
Thermal-heat sinks are designed to draw heat away from a component and transfer it into the surroundings. Heat is dissipated from the source and absorbed by the thermal-heat sink, where it is then dissipated into the atmosphere. This process occurs by a combination of two factors: thermal conduction and thermal convection.
Thermal conduction occurs when the heat is conducted from the source to the surface of the thermal-heat sink. Thermal convection is the natural transfer of heat from a hot to a cold area, which is facilitated by air flowing through the thermal-heat sink. The more effective the thermal-heat sink’s design is, the greater the efficiency of the heat transfer.
The ATS-16F-22-C3-R0 thermal-heat sink is designed with a low-profile design and a large surface area to help dissipate heat more quickly. The material used is an aluminum extrusion frame with an anodized finish for improved thermal conductivity. The integrated thermal binding material helps to increase the thermal conductivity of the thermal-heat sink, allowing for more effective heat transfer.
The specific data is subject to PDF, and the above content is for reference