| Allicdata Part #: | ATS27528-ND |
| Manufacturer Part#: |
ATS-16F-27-C2-R0 |
| Price: | $ 7.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-27-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.94260 |
| 10 +: | $ 6.75486 |
| 25 +: | $ 6.37963 |
| 50 +: | $ 6.00440 |
| 100 +: | $ 5.62918 |
| 250 +: | $ 5.25390 |
| 500 +: | $ 4.87862 |
| 1000 +: | $ 4.78480 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are components used to transfer heat between a process or component and the surrounding environment. They are essential in maintaining a healthy operating temperature for electronic systems which, in turn, helps to protect components from unexpected failure. The ATS-16F-27-C2-R0 is a type of specialized heat sink designed to be used in a variety of applications. In this article, we will discuss the application fields and working principle of this device.
The ATS-16F-27-C2-R0 is a large, device used in high-end thermal industries. It is designed to dissipate large quantities of heat quickly and efficiently, making it ideal for use in thermal sensors, LED lights, and power delivery applications. Additionally, it is capable of handling large and frequent temperature variations with ease, making it well suited for use in high-performance gaming systems and overclocking systems.
The device consists of a thin copper base plate which is highly thermally conductive. This plate is connected to a larger aluminum heat sink body that is designed to disperse the heat away from the copper base plate. The device also makes use of a fan to forcibly move the heat away from the heat sink.
The ATS-16F-27-C2-R0 is capable of operating in a wide range of temperatures with a high level of efficiency due to its special design. This high efficiency is achieved by a combination of the copper base plate, the aluminum body, and the fan. Together, these elements work to quickly and efficiently dissipate large amounts of heat away from the component.
The device also has a very low profile, making it ideal for installations in tight spaces. Additionally, the device is lightweight and durable, allowing it to be used for a wide range of applications without having to worry about a breakdown in performance.
In conclusion, the ATS-16F-27-C2-R0 is a highly efficient heat sink that is designed for use in many different types of applications. It makes use of a thin copper base plate and an aluminum body to efficiently dissipate heat away from the component while a fan helps to move the heat away. The device is also designed to operate in a wide variety of temperature ranges while being lightweight and durable for use in tight spaces. Therefore, the ATS-16F-27-C2-R0 is the ideal heat sink for use in a variety of thermal applications.
The specific data is subject to PDF, and the above content is for reference