| Allicdata Part #: | ATS-16F-29-C3-R0-ND |
| Manufacturer Part#: |
ATS-16F-29-C3-R0 |
| Price: | $ 7.62 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-29-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.86070 |
| 30 +: | $ 6.45687 |
| 50 +: | $ 6.05329 |
| 100 +: | $ 5.64971 |
| 250 +: | $ 5.24619 |
| 500 +: | $ 5.14530 |
| 1000 +: | $ 5.04441 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technologies are becoming more and more popular in commercial and industrial settings. Heat management systems are designed to regulate and redistribute heat generated by electrically-driven devices and components. Heat sinks are an integral part of many thermal management systems. The ATS-16F-29-C3-R0 heat sink is a widely used component in this system.
The ATS-16F-29-C3-R0 heat sink is a 16-pin design manufactured using aluminum. The heat sink is composed of multiple, parallel fins designed to dissipate heat from the connected device and control its temperature. It is easy to install and can be fitted into either a conventional or surface-mount configuration. The ATS-16F-29-C3-R0 has a relatively low profile so that it does not impede the design of the overall thermal management system or the device it is connected to. It is also corrosion resistant and highly durable, allowing it to be used in many environments.
The ATS-16F-29-C3-R0 heat sink is primarily used to regulate temperature in electrical components and circuits. It is designed to dissipate heat from the device or circuit it is connected to and reduce the heat output. As temperatures increase, the heat sink increases its capacity to absorb and dissipate heat away from the system. It also provides structural support to the device or circuit by taking the load off components and relieving stress from the system. This allows the device or circuit to run at more stable temperatures and operate more efficiently.
The ATS-16F-29-C3-R0 heat sink is also used to improve the performance of electronic components and circuits. By cooling the device or circuit, the sink reduces the amount of power consumed and increases the device\'s efficiency. Additionally, its aluminum construction prevents corrosion which can cause electrical shorts or other malfunctions. This makes the ATS-16F-29-C3-R0 a reliable and cost-effective thermal management solution.
In conclusion, the ATS-16F-29-C3-R0 heat sink is a reliable and cost-effective solution for regulating temperature and improving the performance of electrical components and circuits. It is composed of aluminum and designed to dissipate heat away from the system it is connected to. It is corrosion resistant and highly durable, allowing it to be used in many environments. Additionally, it provides structural support to the connected device or circuit and relieves stress from the system. The ATS-16F-29-C3-R0 heat sink is a reliable and cost-effective component in a thermal management system.
The specific data is subject to PDF, and the above content is for reference