ATS-16F-36-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks The ATS-16F-36-C2-R0 is a type of heat sink used in thermal management systems. This type of heat sink is designed to give better performance compared to a traditional aluminum heat sink. It is most commonly used in applications such as power electronics, computer processors, or other high-power components where a high level of heat dissipation is necessary.The ATS-16F-36-C2-R0 heat sink is composed of a thermally conductive material such as copper, aluminum, or a combination of both. This material is designed to absorb and spread heat generated by the component it is cooling. The heat sink is usually machined in a shape that allows air to move through it and transfer heat away from the source. The heat generated by a component is dissipated by the heat sink in two ways. Firstly, the heat conducts directly through the heat sink material from the component to the surrounding air, and secondly the heat radiates out from the surface of the heat sink. The heat sink material is also designed to have a higher thermal conductivity than air which helps to increase the rate at which heat is dissipated.The design of the ATS-16F-36-C2-R0 heat sink also includes different types of fins which are designed to help spread the heat evenly into the surrounding air. The fins are typically made of aluminum and are designed to create an increased surface area on the heat sink which helps to dissipate heat more quickly. The fins also help to create a larger area of airflow which helps to increase the amount of heat which is dissipated.In addition to the fins, the ATS-16F-36-C2-R0 heat sink also includes a fan which helps to blow air directly over the heat sink and further increase the heat dissipation rate. The fan is usually attached to the heat sink via bolts or clips and provides further cooling to the component as it spins at high speeds.Overall, the ATS-16F-36-C2-R0 heat sink is designed to provide superior heat dissipation for high power components such as power electronics, computer processors, or other power components where high levels of heat dissipation are necessary. The heat sink is composed of a thermally conductive material, which is designed to conduct the heat away from the source, and allows air to move through it and transfer the heat to the surrounding air. Additionally, the heat sink includes fins and a fan which further help to dissipate the heat and ensure the component is kept cool.

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